2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) 2021
DOI: 10.23919/ispsd50666.2021.9452217
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A Direct Bond Fabrication Process for Compact GaN Intelligent Power Modules on Liquid Coolers for EV Applications

Namjee Kim
1
,
Wei Jia Zhang
2
,
Joshua Liang
3
et al.
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