2016
DOI: 10.1109/led.2016.2581878
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A Device-Level Characterization Approach to Quantify the Impacts of Different Random Variation Sources in FinFET Technology

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Cited by 20 publications
(5 citation statements)
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References 14 publications
(11 reference statements)
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“…The mean and median đŒ ds − 𝑉 gs characteristics are also shown. It can be seen that the WFV induces strong variations of the SS in case of TFETs, whereas in MOSFETs, the SS has a negligible dependence on the WFV [32]. In contrast to the constant SS in conventional MOSFETs, the SS in TFETs has a dependence on Vgs in the subthreshold region due to the complex dependency of the tunnel current on the transmission probability as well as the number of available states [1].…”
Section: The Influences Of Wfv On Nanowire Tfetsmentioning
confidence: 95%
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“…The mean and median đŒ ds − 𝑉 gs characteristics are also shown. It can be seen that the WFV induces strong variations of the SS in case of TFETs, whereas in MOSFETs, the SS has a negligible dependence on the WFV [32]. In contrast to the constant SS in conventional MOSFETs, the SS in TFETs has a dependence on Vgs in the subthreshold region due to the complex dependency of the tunnel current on the transmission probability as well as the number of available states [1].…”
Section: The Influences Of Wfv On Nanowire Tfetsmentioning
confidence: 95%
“…In addition to the current booster such as heterostructures, the use of the high-k/metal-gate and the scaled nanowire with 20 nm diameter in [4] also attribute to the high current since they together provide the excellent electrostatic control over the channel [7]. It is, therefore, important to understand how the metal gate work-function variations (WFV) affects the scaled nanowire TFET performance and its performanceinduced variability [8].…”
Section: Introductionmentioning
confidence: 99%
“…For these reasons, FinFET technologies are more prone to suffer from process variations such as the line edge roughness (LER) and metal gate granularity (MGG) [4]. These sources of variation generally maintain the chip functioning correctly, but it fails to meet some performance or power criteria increasing the parametric yield loss.…”
Section: Circuit Design For Improve the Reliabilitymentioning
confidence: 99%
“…Moreover, it further has exacerbated the challenge faced by the IC industry as the MOSFETs continuously shrink into the nanometer regime. To overcome these barriers, much effort has been devoted to investigating the impact of various PVs on V T and/or DIBL [5][6][7]. Both experimental and theoretical studies have confirmed that V T and DIBL are very prone to random dopant fluctuation (RDF) effect in nanometer MOSFET channels.…”
Section: Introductionmentioning
confidence: 99%