A critique of reliability prediction techniques for avionics applications

Pandian, Guru Prasad; Das, Diganta; Li, Chuan; Zio, Enrico; Pecht, Michael

doi:10.1016/j.cja.2017.11.004

Cited by 36 publications

(17 citation statements)

References 31 publications

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“…A common criticism for handbook based models is that they do not consider interactions of components but only single-component faults. However, faults due to single-component failures are not dominant [15,4,6,1,11]. As a result the actual field reliabilties can deviate from the predicted ones by orders of magnitude [10].…”

Section: Literature Reviewmentioning

confidence: 97%

“…Stress-and damage models are in general more accurate than handbook based methods. However, the development of such methods requires more effort [15]. Instead of assessing the system on the component level, some approaches use a top-down approach in which the field-reliability of new systems is estimated from field-data of similar systems in operation [8,9].…”

Section: Literature Reviewmentioning

confidence: 99%

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Field-Reliability Predictions Based on Statistical System Lifecycle Models

Felsberger

Kranzlmüller

Todd

2018

Lecture Notes in Computer Science

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Reliability measures the ability of a system to provide its intended level of service. It is influenced by many factors throughout a system life-cycle. A detailed understanding of their impact often remains elusive since these factors cannot be studied independently. Formulating reliability studies as a Bayesian regression problem allows assessment of their impact simultaneously and to identify a predictive model of reliability metrics. The proposed method is applied to currently operational particle accelerator equipment at CERN. Relevant metrics were gathered by combining data from various organizational databases. To obtain predictive models, different supervised machine learning algorithms are applied and compared in terms of their prediction error and reliability. Results show that the identified models accurately predict the meantime between failure of devices-an important reliability metric for repairable systems-and reveal factors which lead to an increased dependability. These results provide valuable inputs for early development stages of highly dependable equipment for future particle accelerators.

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Section: Literature Reviewmentioning

confidence: 97%

Section: Literature Reviewmentioning

confidence: 99%

Field-Reliability Predictions Based on Statistical System Lifecycle Models

Felsberger

Kranzlmüller

Todd

2018

Lecture Notes in Computer Science

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“…One of the most popular standards for this was the American Military Standard MIL217-F [5] but other industrial standards such as Telcordia SR-332 [6] and Siemens SN29500 exist as well. The large discrepancy between calculated and actual lifetime, estimated from field returns, has turned research towards the Design for Reliability (DfR) approach [7][8][9][10], based on Physics of Failure (PoF) models. Furthermore, handbook models such as MIL217-F have been discontinued and are thus not applicable for new components and new packages, e.g., for emerging technologies such as GaN and SiC transistors.…”

Section: Introductionmentioning

confidence: 99%

Practical Considerations for Designing Reliable DC/DC Converters, Applied to a BIPV Case

et al. 2020

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State-of-the-art reliability assessment typically starts from a given circuit topology, for which the most suitable components are selected using a Physics of Failure analysis. This paper, however, addresses the topology selection stage, which is the foundation in designing reliable converters. Based on an overview of the reliability performance of different components, a methodology is presented as a guideline for comparing topologies to one another. The focus is directed at practical consequences associated with certain designs. Furthermore, an overview is provided on the latest developments in component technology reliability improvements. The developed methodology is mainly intended for demanding applications, where long lifetimes are required or elevated ambient temperatures are present. After the topology selection, an overview of possibilities is given that allows further increasing converter availability. Finally, the methodology is applied to the design of module level converters for building integrated photovoltaics, which is a high temperature application with a high desired lifetime. A prototype and experimental results are presented.

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“…It has been a hot and difficult topic to evaluate the health and reliability of electronic equipment in service, especially for electronic equipment in critical system. Health refers to the extent of degradation or deviation from normal conditions [2], based on which the Remaining Useful Life (RUL) can be estimated. Prognostics, as the main content of prognostics and health management (PHM), involves real-time monitoring of health indicators such as current, voltage and strain of electronic devices, based on which the damage of those devices can be estimated and their RULs can be calculated.…”

Section: Introductionmentioning

confidence: 99%

A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature

Jing

Huang

et al. 2020

IEEE Access

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Interconnect structure, as the weak point of reliability, is often the critical part in electronic devices during their service. In order to monitor the health state and degradation of interconnect structure, the charging time is used as the health indicator for interconnect structure of QFP package in this paper. Firstly, a monitoring circuit, based on the proposed electrical model of interconnect structure, is designed to measure the charging time in real time. Secondly, the equivalent circuit of the monitoring circuit is derived and the effect of the parameters of the monitoring circuit on the charging time is analyzed. Then, experiments under vibration and steady temperature are conducted to analyze the failure of interconnect structure and derive the damage model. Finally, the effect of charging time as the health indicator to monitor the damage of interconnection structures is analyzed and the uncertainty is discussed. Results show that the charging time is directly related to the interconnect damage and can well characterize the interconnect failure, which can be used as a health indicator to assess the damage and predict the failure of interconnect structure.

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A critique of reliability prediction techniques for avionics applications

Cited by 36 publications

References 31 publications

Field-Reliability Predictions Based on Statistical System Lifecycle Models

Field-Reliability Predictions Based on Statistical System Lifecycle Models

Practical Considerations for Designing Reliable DC/DC Converters, Applied to a BIPV Case

A Health Indicator for Interconnect structure of QFP Package Under Vibration and Steady Temperature

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