A critical review of thermal models for electro-thermal simulation

Fast 3D thermal simulation of power module packaging

“…The power inputs were all uniformly spread across the heat source regions for all of the test cases. In reality, the shape of the heat source is dependent on power dissipation across the chip . A feature of the Fourier series model is that it can accurately describe any heat source distribution because they are in Fourier series form.…”

Analytical modelling of temperature distribution in resistive thin-film thermal sensors

“…The methods based on the electro-thermal analogy make it possible to rapidly estimate the temperature of the resistive layer but they are rough and do not allow one to determine the temperature distribution in the sensor structure [3,4].…”

“…(2)-(5) contain six types of the unknown weighting coefficients: δ ( , and δ (3,4) m . To determine these coefficients one can use four temperature equality conditions on the boundaries between the adjacent regions and two Newton boundary conditions on the boundaries between the regions 1 and 2 and the ambient air.…”

Dynamic electro-thermal simulation of microsystems—a review

“…Examples are the thin rectangular heat source or a volume heat source on the top of an infinite medium. The latter is often used for modeling a bipolar transistor (see [50] and the references there). Another example is a stacked layer structure that can be infinitely extended in length and with directions, used for modeling a power FET transistor [51].…”