A compact model for predicting the isolation of ports in a closed rectangular microchip package

Olson, H.M.

doi:10.1109/22.481388

Cited by 3 publications

(2 citation statements)

References 5 publications

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“…The availability of computational models for each of the paths would be of great assistance in this respect. We devised such a model for the coupling via electromagnetic fields excited in the interior of the package [6]. We did this by treating the package as a rectangular cavity excited by short microstrip probes to simulate the actual package with RF ports on opposite sides.…”

Section: Mmic Package Design and Composite Modelmentioning

confidence: 99%

Multichip MMIC package for X and K/sub a/ bands

Decker

Olson

Tatikola

et al. 1997

IEEE Trans. Comp., Packag., Manufact. Technol. B

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A new multichip monolithic microwave integrated circuit (MMIC) package operable to X and Ka bands has been developed and tested. This package provides space for mounting up to five MMIC chips and has three radio frequency (RF) and five dc feed-throughs. The RF feed-throughs are of a mixed-mode, conductor-backed coplanar waveguide design that minimizes reflections and insertion loss over a wide bandwidth. The dc feed-throughs permit bias access for up to five chips and internal mounting of chip bypass capacitors. Prototypes of the package have been built and tested using miniature coplanar probes. Test results indicate that the RF feed-throughs meet design goals to about 30 GHz and can be used to about 35 GHz. The package has been analyzed using a "Composite Model" approach in which individual elements are separately analyzed and modeled and then combined in a circuit simulator to provide a complete package model. This approach has provided quite good agreement with measured data.Index Terms-Computer modeling, IC packaging, microwave measurements, monolithic microwave integrated circuit (MMIC).

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Section: Mmic Package Design and Composite Modelmentioning

confidence: 99%

Multichip MMIC package for X and K/sub a/ bands

Decker

Olson

Tatikola

et al. 1997

IEEE Trans. Comp., Packag., Manufact. Technol. B

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“…Liang et al [7] have discussed the method to deduce the package effects associated with the package lead capacitance, the self and mutual inductances of the bond wires, and the coupling between the input and output of metal ceramic packages for packaging of power transistors by using a combination of full wave EM simulation and equivalent circuit extraction. In case of metal ceramic packages, the primary causes for the influence on MMIC performance could be either the cavity resonance [8] or isolation between ports of the package [9]. The inductive connections between the chip and the package pads/feedthrus also seriously affect the performance of the packaged device due to formation of ground loops in the interface area exposed to ground due to any gap between the chip and the interconnect or between two interconnects.…”

Section: Introductionmentioning

confidence: 99%

Electromagnetic Simulation and Characterization a Metal Ceramic Package for Packaging of High Isolation Switches

Chaturvedi¹,

Bhalke²,

Saravanan³

et al. 2010

PIER C

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Abstract-Packaging of planar MMICs poses a unique challenge at microwave frequencies as the dimensions of the encapsulating cavity are comparable to wavelength at the operational frequencies. In addition, the effect of ground loops (caused by bond wires exposed to ground over extended length due to gaps between interconnects) deteriorates the situation even further in circuits like MMIC switches requiring high isolation between ports. The ground loops cause reflections thereby deteriorating the insertion loss figure of merit. This paper presents optimization of design of a metal ceramic package used for packaging an SPDT MMIC switch working in the frequency range of 5-6 GHz. The microwave performance of the package was simulated using EM simulation with parameters including cavity dimensions, port placement, gaps between interconnect lines, package feed-thrus and MMIC chip pads. Detailed characterization of the bare package and packaged SPDT MMIC done later shows a good match between the simulated and measured performance. The SPDT MMIC performance degradation was arrested by improvement in the package structure and it showed insertion loss of −1.6 dB and input/output (I/O) return losses of ∼ 16 dB in the new package as compared to the values of −2.1 dB insertion loss and −12 dB I/O return losses in the original package. The port-to-port isolation remained unchanged (∼ 40 dB in both cases) as it is governed by the MMIC assembly inside the package rather than the conditions at the I/O interfaces in this kind of large sized packages.

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