2012 Proceedings of the ESSCIRC (ESSCIRC) 2012
DOI: 10.1109/esscirc.2012.6341354
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A 576 Mb DRAM with 16-channel 10.3125Gbps serial I/O and 14.5 ns latency

Abstract: A 576 Mb DRAM is implemented with 16 serial links at 10.3125Gbps. Using careful memory/SerDes/package codesign, the system achieves 14.5ns latency and 24.75GByte/s read/write bandwidth. It achieves SRAM-like random access by using logic-compatible 65nm GP embedded DRAM and small 36 Kb sub-arrays with hidden refresh.

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Cited by 2 publications
(3 citation statements)
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“…We stress-tested units of 576 Mb embedded DRAM products in 65nm [5] and 40nm logic processes. The units were characterized with a wide range of retention times to detect any shift over time.…”
Section: Technology: Aging Bits and Vrtmentioning
confidence: 99%
“…We stress-tested units of 576 Mb embedded DRAM products in 65nm [5] and 40nm logic processes. The units were characterized with a wide range of retention times to detect any shift over time.…”
Section: Technology: Aging Bits and Vrtmentioning
confidence: 99%
“…Instead, we chose to place the SerDes circuits in the middle of the die, close to the core logic, to reduce on-chip routing delay. 11 We left the package balls for the high-speed serial I/Os at the edges of the package, because this position reduces the complexity of signal escape on the board. To manage supply noise coupling, we did careful simulation followed by silicon validation.…”
Section: Codesign Of Die and Packagementioning
confidence: 99%
“…This delay consists of two memory cycles (80 UI), four core cycles (40 UI), RXþTX delay in the SerDes (24 UI), and propagation in the chip and package (0.5 ns). 11 With two eight-lane GCI ports operating at 10.3 Gbps, the BE-1 achieves high throughput for single-word read and write commands. It can do 2.06 billion reads per second or 1.03 billion writes per second.…”
Section: Latency and Access Ratementioning
confidence: 99%