1987
DOI: 10.1109/jssc.1987.1052863
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A 512×512-element PtSi Schottky-barrier infrared image sensor

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Cited by 50 publications
(17 citation statements)
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“…Major difficulty in enlarging the fill factor results from the storage balance design between the detector and vertical CCD in the conventional interline transfer CCD readout architecture. We have devised a readout architecture called Charge Sweep Device (CSD) [2] in order to break through the limitation in the conventional IL-CCD readout architecture and realize high resolution and high sensitivity monolithic PtSi SB FPAs. The CSD is constructed with a consecutive MOS gate array, and its signal charges are transferred by a mechanism based on the charge-coupled concept, in the same way as CCDs.…”
Section: Charge Sweep Devicementioning
confidence: 99%
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“…Major difficulty in enlarging the fill factor results from the storage balance design between the detector and vertical CCD in the conventional interline transfer CCD readout architecture. We have devised a readout architecture called Charge Sweep Device (CSD) [2] in order to break through the limitation in the conventional IL-CCD readout architecture and realize high resolution and high sensitivity monolithic PtSi SB FPAs. The CSD is constructed with a consecutive MOS gate array, and its signal charges are transferred by a mechanism based on the charge-coupled concept, in the same way as CCDs.…”
Section: Charge Sweep Devicementioning
confidence: 99%
“…Their specifications and performances are summarized in Table 1. All the 512x512 element FPAs in Table 1 have a pixel size of 26x20 im2. The earliest 512x512 element FPA, developed in 1987, was made with design rules of 2 jim and had a relatively small fill factor of 39% [2]. We have improved the fill factor of the same size pixel to 58% with 1.5 jim design rules and to 71% with 1.2 jim design rules [6].…”
Section: Design and Performance Of 2-d Fpasmentioning
confidence: 99%
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“…Many of these devices rely on a thin active layer (e.g., <10 nm PtSi or Pd 2 Si) where infrared (IR) absorption creates hot carriers that are eventually separated at the PtSi/Si Schottky junction and emitted into the Si substrate [1][2][3][4][5][6][7][8][9][10][11][12][13][14]. Elastic scattering at interfaces and grain boundaries in the PtSi layer is beneficial because it increases the probability of internal photoemission by increasing the chance that carriers will be redirected into the Si.…”
mentioning
confidence: 99%
“…In recent years, platinum silicide (PtSi) SB IR image s e n m have been developed, which have TV spatial resolution and a noise equivalent temperature difference between 0.1 and 0.2 K (2)(3). Some commercial IR cameras using these image sensors are available for thermal imaging in the 3-5 pm infrared band.…”
Section: Introductionmentioning
confidence: 99%