A 12-bit 1-MS/s 26-μW SAR ADC for Sensor Applications

Yen, Chia-Wei; Tsai, C. T.

doi:10.1515/9781501501531-008

Cited by 2 publications

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“…Colorimetry [7] and AAS [8,9,10,11,12] have been widely used but these methods are not very sensitive. Graphite furnace atomic absorption spectrometry (GF-AAS) has also been used for soft drinks and milk [13,14].…”

Section: Introductionmentioning

confidence: 99%

Determination of total tin in canned food using inductively coupled plasma atomic emission spectroscopy

Perring

Basic-Dvorzak

2002

Anal Bioanal Chem

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Tin is considered to be a priority contaminant by the Codex Alimentarius Commission. Tin can enter foods either from natural sources, environmental pollution, packaging material or pesticides. Higher concentrations are found in processed food and canned foods. Dissolution of the tinplate depends on the of food matrix, acidity, presence of oxidising reagents (anthocyanin, nitrate, iron and copper) presence of air (oxygen) in the headspace, time and storage temperature. To reduce corrosion and dissolution of tin, nowadays cans are usually lacquered, which gives a marked reduction of tin migration into the food product. Due to the lack of modern validated published methods for food products, an ICP-AES (Inductively coupled plasma-atomic emission spectroscopy) method has been developed and evaluated. This technique is available in many laboratories in the food industry and is more sensitive than atomic absorption. Conditions of sample preparation and spectroscopic parameters for tin measurement by axial ICP-AES were investigated for their ruggedness. Two methods of preparation involving high-pressure ashing or microwave digestion in volumetric flasks were evaluated. They gave complete recovery of tin with similar accuracy and precision. Recoveries of tin from spiked products with two levels of tin were in the range 99+/-5%. Robust relative repeatabilities and intermediate reproducibilities were <5% for different food matrices containing >30 mg/kg of tin. Internal standard correction (indium or strontium) did not improve the method performance. Three emission lines for tin were tested (189.927, 283.998 and 235.485 nm) but only 189.927 nm was found to be robust enough with respect to interferences, especially at low tin concentrations. The LOQ (limit of quantification) was around 0.8 mg/kg at 189.927 nm. A survey of tin content in a range of canned foods is given.

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Section: Introductionmentioning

confidence: 99%

Determination of total tin in canned food using inductively coupled plasma atomic emission spectroscopy

Perring

Basic-Dvorzak

2002

Anal Bioanal Chem

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“…In spite of the decrease in the etch rate, the addition of IPA to the TMAH solution improved the etch-stopped surface flatness [13]. On the other hand, the addition of pyrazine to the TMAH:IPA solution increased the etch rate, and also improved the etchstopped surface simultaneously [20]. Fig.…”

Section: Electrochemical Etch-stop Characteristics Of Siliconmentioning

confidence: 99%

Anisotropic etching and electrochemical etch-stop properties of silicon in TMAH:IPA:pyrazine solutions

Chung

2001

Met. Mater. Int.

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Anisotropic etching and electrochemical etch-stop properties of single-crystal silicon in tetramethylammonium hydroxide (TMAH): isopropyl alcohol (IPA) solutions containing pyrazine were investigated. With the addition of IPA to TMAH solution, an improvement in flatness on the etching front and a reduction in undercutting were observed, but the etch rate on (100) silicon decreased. However, the (100) silicon etch rate is improved by the addition of pyrazine. An etch rate of 0.8 μm/min on (100) silicon, which is faster by 13% than a 20 wt.% solution of pure TMAH, is obtained using 20 wt.% TMAH:0.005 g/ml pyrazine solutions, but the etch rate on (100) silicon is decreased if there is an increase in the amount of pyrazine in the solution. With the addition of pyrazine to a 25 wt.% TMAH solution, no significant variations in flatness on the etching front were observed and the undercutting ratio was reduced by 30~50%. The addition of pyrazine to TMAH:IPA solutions increased the etch rate of (100) silicon, thus the time required by the etch-stop process was shortened. The current-voltage (I-V) characteristics of n-and p-type silicon in TMAH:IPA:pyrazine solutions were obtained. The passivation potential (PP) of n-and p-type silicon was obtained and the applied potential was selected between n-and p-type silicon PPs. The electrochemical etch-stop method was applied to the fabrication of 801 silicon microdiaphragms of 20 μm thickness on a 5-inch silicon wafer. The average thickness of fabricated 801 microdiaphragms on one wafer was 20.03 μm and the standard deviation was ±0.26 μm. The silicon surface of the etch-stopped microdiaphragms was extremely flat with no noticeable taper or non-uniformity. The benefits of the electrochemical etch-stop method for the anisotropic etching of silicon in TMAH:IPA:pyrazine solutions become apparent when reproducibility of silicon microdiaphragm thickness for mass production is realized. The results indicate that use of the electrochemical etch-stop method for the anisotropic etching of silicon in TMAH:IPA:pyrazine solutions provides a powerful and versatile alternative process for fabricating highyield silicon microdiaphragms.

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A 12-bit 1-MS/s 26-μW SAR ADC for Sensor Applications

Cited by 2 publications

References 0 publications

Determination of total tin in canned food using inductively coupled plasma atomic emission spectroscopy

Determination of total tin in canned food using inductively coupled plasma atomic emission spectroscopy

Anisotropic etching and electrochemical etch-stop properties of silicon in TMAH:IPA:pyrazine solutions

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