A 10 Gb/s Si-bipolar TX/RX chipset for computer data transmission

SiGe HBT BiCMOS for 2-160 Gb/s Next Generation Internet (NGI)

“…The first applicable paper seriously examined when this project began described a complete monolithic10Gb/s TX/RX chipset [2] in a 25GHz fT Si-Bipolar process, published in 1998, which was used as a launching point for the work. This paper described a method of using multiphase clocks to extract timing information for a high speed receiver.…”

“…A novel method of generating quadrature signals at the same frequency as a reference is given in [24]. The "leap frog" architecture mentioned in [2] achieves a higher frequency of operation over a traditional ring of buffers/inverters via the 50-50 interpolation of the phase entering each buffer with the previous phase signal. The frequency control is implemented via variable propagation delay in the buffers.…”

“…However, that design was very asymmetric and 49 unsuitable for uniform phase applications such as ours. Lastly, the VCO architecture in [27] is nearly identical to that in [2], except that the fed forward phase passes through a buffer external to the ring rather than one inside it. That allows the external buffer to add delays without compromising the maximum frequency of the buffers inside the ring.…”

“…In addition, several small VCO test structures were fabricated. These chips were the initial design experience and drew heavily upon [2]. They included a 10-20Gbps transmitter/receiver pair that utilized a multiphase clocking scheme to eliminate the need for a full frequency clock.…”

Flexible optical waveguide film fabrications and optoelectronic devices integration for fully embedded board-level optical interconnects

“…In particular, IMPS is focused on the signal integrity, such as controlled impedance signal transmission with very low crosstalk. The electrical interconnection described by Walker et al provides a 10-Gb/s link over a distance of less than 20 m using coaxial cable [6]. However, coaxial cabling is bulky; therefore, it is not suitable for a high-density interconnection application.…”