60-GHz LTCC Differential-Fed Patch Antenna Array With High Gain by Using Soft-Surface Structures

Jin, Huayan; Che, Wenquan; Chin, Kuo‐Sheng; Shen, Guangxu; Yang, Wanchen; Xue, Quan

doi:10.1109/tap.2016.2631078

Cited by 59 publications

(21 citation statements)

References 40 publications

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“…As mentioned above, this issue is relevant to LTCC AiP designs because LTCC substrates have relatively high dielectric constants and can be quite thick for some designs. One effective surface wave suppression method is to use the electromagnetic band-gap (EBG) structure, which is perfectly compatible with multilayered LTCC fabrication [59][60][61]. The soft surface structure is one class of EBG structures that behaves as a perfect electrical conductor for the TE mode and as a perfect magnetic conductor for the TM mode, therefore, the soft surface has the stopband characteristics along the soft direction shown in Figure 7.17 (a) [61].…”

Section: Gain Enhancement Techniques In Ltccmentioning

confidence: 99%

“…One effective surface wave suppression method is to use the electromagnetic band-gap (EBG) structure, which is perfectly compatible with multilayered LTCC fabrication [59][60][61]. The soft surface structure is one class of EBG structures that behaves as a perfect electrical conductor for the TE mode and as a perfect magnetic conductor for the TM mode, therefore, the soft surface has the stopband characteristics along the soft direction shown in Figure 7.17 (a) [61]. As can be seen in Figure 7.17 (b), the soft surfaces have been implemented between the LTCC-based patch antenna array to realize a stopband for suppressing the surface waves.…”

Section: Gain Enhancement Techniques In Ltccmentioning

confidence: 99%

“…Fig. 7.17 (a) Geometry of the via-loaded strip soft surface structure (b) 4 × 4 patch antenna array with soft surfaces[61] 18 Sievenpiper EBG embedded 60 GHz 2 × 2 antenna array[60] …”

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confidence: 99%

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Antenna‐in‐package Designs in Multilayered Low‐temperature Co‐fired Ceramic Platforms

Shamim

Zhang

2020

Antenna‐in‐Package Technology and Applications

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Consistent with the SoP concept, AiP is an antenna that is realized on the package of the driving circuit [2]. There are many advantages of AiP that are beneficial for RF systems, the most prominent being the ability of realizing multilayer (vertically integrated) antennas that reduce the overall size of the system. Further, no separate printed circuit boards (PCB) for antenna realization or connections to an external antenna board are required, increasing compactness and cost savings. Finally, efficient antennas can be realized in low loss packaging technologies, particularly at mmWave bands. These aspects are discussed in detail in the coming sections. Low-temperature co-fired ceramic (LTCC) is one of the mainstream technologies for AiP designs. This chapter focuses on AiP designs in LTCC technology. Before moving on to details of AiP design, LTCC technology is introduced in the next section. Section II LTCC Technology LTCC is a multilayer ceramic tape system, which has recently gained popularity not only as a packaging technology but also as an efficient medium to realize passive components. In this section, we first briefly introduce the LTCC technology and then discuss the advantages and issues related to this technology. Later parts of the chapter focus on the LTCC process flow in detail. Finally, we list the major LTCC material suppliers and worldwide service foundries as a quick reference guide for readers.

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Section: Gain Enhancement Techniques In Ltccmentioning

confidence: 99%

Section: Gain Enhancement Techniques In Ltccmentioning

confidence: 99%

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Antenna‐in‐package Designs in Multilayered Low‐temperature Co‐fired Ceramic Platforms

Shamim

Zhang

2020

Antenna‐in‐Package Technology and Applications

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“…A type of material with low dielectric constant and small loss tangent is desired. As a matter of fact, there are several suitable integration technology candidates such as low temperature co-fired ceramics (LTCC), hybrid LTCC [29], multi-layer organics (MLO) [30], liquid crystal polymer (LCP) [31], etc. Considering the cost, mass production and industrial maturity [32], an MLO-like structure is adopted as it has shown profound value on commercial mass production in IEEE 802.11ad products [6].…”

Section: Beamforming Module Hardware Designmentioning

confidence: 99%

5G Cellular User Equipment: From Theory to Practical Hardware Design

2017

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Research and development on the next generation wireless systems, namely 5G, has experienced explosive growth in recent years. In the physical layer (PHY), the massive multiple-input-multiple-output (MIMO) technique and the use of high GHz frequency bands are two promising trends for adoption. Millimeter-wave (mmWave) bands such as 28 GHz, 38 GHz, 64 GHz, and 71 GHz, which were previously considered not suitable for commercial cellular networks, will play an important role in 5G. Currently, most 5G research deals with the algorithms and implementations of modulation and coding schemes, new spatial signal processing technologies, new spectrum opportunities, channel modeling, 5G proof of concept (PoC) systems, and other system-level enabling technologies. In this paper, we first investigate the contemporary wireless user equipment (UE) hardware design, and unveil the critical 5G UE hardware design constraints on circuits and systems. On top of the said investigation and design trade-off analysis, a new, highly reconfigurable system architecture for 5G cellular user equipment, namely distributed phased arrays based MIMO (DPA-MIMO) is proposed. Finally, the link budget calculation and data throughput numerical results are presented for the evaluation of the proposed architecture.Comment: Submitted to IEEE ACCESS. It has 18 pages, 17 figures, and 5 table

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“…However, at 60 GHz MMW bands, these approaches are found least efficient in terms of achieving the desired electrical performance and bearing minor errors due to fabrication tolerances. Several other antennas based on low-temperature co-fired ceramic (LTCC) technology operating at 60 GHz frequency bands are demonstrated in the literature [13]. It can be inferred from their reported results that antenna arrays designed using LTCC technology can produce high-gain unit cells.…”

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confidence: 99%

Broadband High-Gain Antenna for Millimetre-Wave 60-GHz Band

et al. 2019

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This paper focuses on the 60 GHz band, which is known to be very attractive for enabling next-generation abundant multi-Gbps wireless connectivity in 5G communication. We propose a novel concept of a double-layer antenna, loosely inspired from standard log-periodic schemes but with an aperiodic geometry, reduced size, and a limited number of elements while achieving excellent performance over the entire 60 GHz band. To maximize the antenna's efficiency, we have developed a design that differs from those traditionally used for millimeter-wave communication applications. We aim to simultaneously maximize the gain, efficiency, and bandwidth. The reflection coefficient of the proposed design achieves a bandwidth of 20.66% from 53.9 GHz up to 66.3 GHz, covering the entire frequency band of interest. In addition, this proposed structure achieves a maximum realized gain of 11.8 dBi with an estimated radiation efficiency of 91.2%. The proposed antenna is simulated, fabricated, and tested in an anechoic chamber environment. The measurement data show a reasonable agreement with the simulation results, with respect to the bandwidth, gain, and side-lobe level over the operational spectrum.2 of 12 paradigm, a printed antenna based on microstrip technology is a suitable alternative for satisfying the desired requirements. However, conventionally, microstrip antennas designed at the MMW bands typically exhibit low gain, low efficiency due to substrates' losses, and narrow bandwidth [3]. Typically, for an emblematic wireless application, the desired physical and electrical specifications of the MMW antennas are achieved by carefully selecting an appropriate antenna terminology, with an advanced technology used for prototyping and realization by adopting suitable design approaches with modifications to the conventional antenna types [4]. Antenna arrays are usually used for high-gain frontend MMW wireless terminals [5]. However, such an approach is discouraged due to the considerable power losses and loss of compactness because of the mismatches among various circuit elements and the extended feeding network. In reference [6], an MMW antenna array operating at 60 GHz was designed and tested. The designed array of 16 × 16 elements exhibits a high gain of 30.5 dBi but with a low efficiency of around 40%. An antenna array of 10 elements operating at 60 GHz was presented that exhibits a maximum gain of 13 dBi with an efficiency of 63% [7]. In references [8] and [9], typical arrays of patch antenna elements were chosen to achieve high-gain. The realized gain cannot be higher than 19.6 dBi and 17.5 dBi using the 4 × 4 elements. However, both types of arrays operate over a wide bandwidth, which is around 27.5%. As an alternative, to enhance the bandwidth and the gain of microstrip-based antennas simultaneously, an aperture-coupled feeding approach has been suggested [9][10][11][12]. However, micromachining is required for the development of the multilayer circuits, which increases the complexity, cost, and vulnerability to the fabricatio...

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60-GHz LTCC Differential-Fed Patch Antenna Array With High Gain by Using Soft-Surface Structures

Cited by 59 publications

References 40 publications

Antenna‐in‐package Designs in Multilayered Low‐temperature Co‐fired Ceramic Platforms

Antenna‐in‐package Designs in Multilayered Low‐temperature Co‐fired Ceramic Platforms

5G Cellular User Equipment: From Theory to Practical Hardware Design

Broadband High-Gain Antenna for Millimetre-Wave 60-GHz Band

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