2016
DOI: 10.1109/led.2016.2533432
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4H-SiC Trench MOSFET With L-Shaped Gate

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Cited by 53 publications
(20 citation statements)
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“…Schottky barrier lowing model and tunnelling models are also involved in the simulations to characterise the SBD performances [17]. Related model parameters have been optimised and applied in previous simulation studies [3,18,19].…”
Section: Device Structure and Simulation Setupmentioning
confidence: 99%
See 1 more Smart Citation
“…Schottky barrier lowing model and tunnelling models are also involved in the simulations to characterise the SBD performances [17]. Related model parameters have been optimised and applied in previous simulation studies [3,18,19].…”
Section: Device Structure and Simulation Setupmentioning
confidence: 99%
“…Silicon carbide devices are considered to be one of the most promising candidates for next-generation power semiconductor devices due to their excellent material properties [1][2][3]. Among them, SiC MOSFETs have received extensive attention because of their low on-state resistance and high thermal conductivity [1].…”
Section: Introductionmentioning
confidence: 99%
“…Moreover, based on the existing literature, there are two domination ways used to improve the device’s performances. One is to adopt a new structure [ 7 , 8 , 9 , 10 , 11 , 12 , 13 , 14 , 15 , 16 , 17 , 18 ], with a mechanism that reduces the JFET resistance. The other is adopting a new fabrication process for the gate oxide [ 19 , 20 , 21 , 22 , 23 , 24 , 25 ], which increases the channel’s electron mobility to achieve a reduction in the resistance.…”
Section: Introductionmentioning
confidence: 99%
“…The Eoxm should be typically <4 MV/cm when the device is in the blocking mode [2]. There have been efforts to address this problem by introducing novel designs such as L‐shaped gate [3], shielded fin‐shaped gate [4], non‐uniform doping floating islands [5], dual P+ shielding region at the trench bottom [6], and so on. Although trench MOSFETs have relatively low Ron×A compared to the planar device due to the absence of JFET region, the resistance due to drift region )(Rdrift of the device is almost the same.…”
Section: Introductionmentioning
confidence: 99%