45-degree curved micro-mirror for vertical optical I/O of silicon photonics chip

Noriki, Akihiro; Amano, Tsuyoshi; Shimura, Daisuke; Onawa, Yosuke; Yaegashi, Hiroki; Sasaki, Hirokazu; Mori, Masahiko

doi:10.1364/oe.27.019749

Cited by 16 publications

(6 citation statements)

References 26 publications

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“…By using a gray-tone optical lithography, [28][29][30] we integrated the micro mirrors on a Si photonics as reported in the previous work. 25) First, a photosensitive polyimide was spin coated on a Si substrate. Next, mirror structures were transferred to the polyimide by using the gray-tone optical lithography process.…”

Section: Experimental Methodsmentioning

confidence: 99%

“…To overcome this problem, we recently demonstrated a vertical optical coupling using a 45°curved micro mirror. 25,26) The curved 45°mirror is very attractive because it works like a lens and realizes beam-waist conversion, beam-focusing, and/or beam-collimating functions for a Si photonics I/O. The schematic of the vertical optical coupling using the 45°curved micro mirror is shown in Fig.…”

Section: Introductionmentioning

confidence: 99%

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Beam waist controlled vertical optical path conversion using integrated curved micro mirror for silicon photonics

Noriki

Amano

2020

Jpn. J. Appl. Phys.

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The optical input/output (I/O) of silicon (Si) photonics is a significant challenge in terms of its practical application. We recently demonstrated a vertical optical I/O using a 45°curved micro mirror. In this paper, the beam conversion controllability of the curved micro mirrors was studied. Different design curved micro mirrors were fabricated and those beam conversions were evaluated. The beam waist of the reflected light was successfully controlled by tuning the curvatures of the mirror. The experimental data were well agreed with simulation results. The coupling efficiency improvement between the mode mismatched fibers (a single-mode fiber and a spherical lensed fiber) was also demonstrated by using the curved mirror. Owing to the beam waist conversion, the coupling efficiency was improved by 3.3 dB. Very flat spectral characteristics were also obtained.

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Section: Experimental Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Beam waist controlled vertical optical path conversion using integrated curved micro mirror for silicon photonics

Noriki

Amano

2020

Jpn. J. Appl. Phys.

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“…To connect the polymer and Si waveguides, a coupling structure based on two micro mirrors was used. It provided low wavelength and polarization-dependent optical coupling as compared with a grating coupler, which is a popular surface coupling device [7], [8]. As shown in Fig.…”

Section: Components For Optical Redistributionmentioning

confidence: 99%

“…First, a cavity was formed on the surface of the Si photonics die to integrate a bottom-side mirror. Next, the mirror was fabricated by gray-scale lithography, as described previously [7], [8]. Then, the mirror was coated with a reflective metal layer and encapsulate by a transparent resin.…”

Section: Fabricationmentioning

confidence: 99%

Characterization of Optical Redistribution Loss Developed for Co-Packaged Optics

Noriki

Tamai

Ibusuki

et al. 2022

IEEE Photon. Technol. Lett.

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“…This method has a typical large footprint and lacks the selectivity for different modes or polarizations. Moreover, in order to focus the output beams, the 45-degree curved micro-mirror is needed [45]. Afterall, the reported solution is still bulky and lacks polarization selectivity.…”

Section: Vertical Out-coupler For Multilayer Waveguidesmentioning

confidence: 99%

Light manipulation in three-dimensional photonic integrated circuits using vertically inserted metasurfaces

Wu¹,

Zhang²

2021

Phys. Scr.

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The hybrid integration of silicon metasurfaces, in forms of insertable thin-film elements, into a multilayer polymer waveguide platform is introduced. Owing to the wavelength comparable thickness and high efficiency of the dielectric metasurfaces, the designed devices can manipulate beams in a relatively short distance with low insertion loss. They can also realize functions critical for three-dimensional (3D) photonic integrated circuits (PICs) that are difficult for conventional micro-optic elements. The designs of several key photonic components are presented in this work as proof-of-concept. Specifically, three applications based on the proposed platform are demonstrated numerically, including on-chip beam collimation, spatial mode (de)multiplexing, and focusing vertical out-coupling. These functionalities can be realized within a short propagating length. This work presents a theoretical study on the design principles and performances of the proposed devices, which can be implemented by adopting the existed technology of inserting classic thin-film elements into photonic chips in the near future. The results suggest a novel and general path for optical signal manipulations within the 3D photonic chips and may prove useful in the design of transceiver devices for optical communication, optical sensor chips, compact chips for optical computation, etc.

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45-degree curved micro-mirror for vertical optical I/O of silicon photonics chip

Cited by 16 publications

References 26 publications

Beam waist controlled vertical optical path conversion using integrated curved micro mirror for silicon photonics

Beam waist controlled vertical optical path conversion using integrated curved micro mirror for silicon photonics

Characterization of Optical Redistribution Loss Developed for Co-Packaged Optics

Light manipulation in three-dimensional photonic integrated circuits using vertically inserted metasurfaces

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