No abstract

Optical I/O core based on silicon photonics technology and optical/electrical assembly was developed as a fingertip-size optical module with high bandwidth density, low power consumption, and high temperature operation. The advantages of the optical I/O core, including hybrid integration of quantum dot laser diode and optical pin, allow us to achieve 300-m transmission at 25 Gbps per channel when optical I/O core is mounted around field-programmable gate array without clock data recovery.

No abstract

No abstract

No abstract

The thermal tolerance of mirror-based optical redistribution is analyzed for co-packaged optics. In physical optics propagation analysis, considering thermal deformation, a coupling efficiency of over 0.9 is obtained in the range 0–100 °C.

We propose a next generation co-packaged substrate using Si photonics dies, a polymer optical waveguide, and a optical connector to achieve beyond 10 Tb/s and WDM optical links. The two micro-mirrors and polymer waveguides were integrated, and their optical characteristics were evaluated.

No abstract