Characterization of Optical Redistribution Loss Developed for Co-Packaged Optics

Noriki, Akihiro; Tamai, Isao; Ibusuki, Yasuhiro; Ukita, Akio; Suda, Satoshi; Takemura, Koichi; Shimura, Daisuke; Onawa, Yosuke; Yaegashi, Hiroki; Amano, Tsuyoshi

doi:10.1109/lpt.2022.3191645

Cited by 6 publications

(6 citation statements)

References 9 publications

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“…This is because the fabricated bottom-and top-side mirrors were not optimal structures, as mentioned above. However, in previous works, we have demonstrated efficient mirror coupling of 3.6 dB experimentally [11] and 0.5 dB in a simulation. Thus, by optimizing the mirrors, lower transmission losses can be achieved.…”

Section: A Optical Spectrum and Insertion Lossmentioning

confidence: 70%

Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics

Noriki

Ukita

Takemura³

et al. 2023

J. Lightwave Technol.

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To realize a new package substrate for co-packaged optics, a silicon-photonics hybrid glass-epoxy substrate was demonstrated. In the substrate, silicon photonics dies working as optical/electrical conversion engines are embedded. Additionally, it includes optical redistribution composed of polymer waveguides and mirror-based optical coupling structures between the polymer and silicon waveguides. A demonstration sample was designed for a total bandwidth of 10 Tbps using silicon photonics dies with arrayed waveguide gratings, wavelength splitters, and polarization splitters/rotators for 16-ch wavelength division multiplexing (WDM). It was fabricated using unique key technologies, such as silicon photonics embedding, micromirror fabrication, and single-mode polymer waveguide fabrication. Its wavelength multiplexing operation and signal transmission characteristics were evaluated. As a result, the hybrid substrate was discovered to be capable of 112 Gbps pulse amplitude modulation 4 (PAM-4) transmission with a 16-ch WDM function because the transmitter dispersion and eye closure quaternary (TDECQ) values of less than 3.4 dB were obtained and 16-ch WDM spectrum were clearly visible. To the best of our knowledge, the working of such a hybrid substrate was demonstrated for the first time. This demonstration implies that the hybrid substrate is feasible, and the above-mentioned novel technologies are crucial to its development.

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Section: A Optical Spectrum and Insertion Lossmentioning

confidence: 70%

Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics

Noriki

Ukita

Takemura³

et al. 2023

J. Lightwave Technol.

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“…The 3D top-and bottomside mirrors were formed using UV grayscale lithography, and the polymer layers were patterned using laser lithography. The details of the fabricated DUT sample with optical redistribution are explained in a previous study [14]. The setup for measuring the thermal characteristics of the DUT is shown in Fig.…”

Section: Methodsmentioning

confidence: 99%

“…Following this specification, the CPO module requires the ability to operate from 15 °C to 85 °C. The low-loss transmittance of the optical redistribution at room temperature has been confirmed so far [14,15]; however, the temperature-dependent characteristics have not been sufficiently verified yet.…”

Section: Introductionmentioning

confidence: 98%

“…To meet this demand. we have recently proposed one of CPO configurations, which is named active optical package (AOP) substrate [14,15], where silicon photonics chip is embedded on the packaged substrate and electrical components can be integrated close to optics. In the AOP, polymer waveguides are used as optical links on the substrate, and optical connection between silicon photonics and a polymer waveguide are required.…”

Section: Introductionmentioning

confidence: 99%

“…Some coupling technologies have been developed for silicon photonics, such as spot size converters [16], grating couplers [17], and adiabatic couplers [18]. For achieving lowloss broadband optical coupling, 3D micro-mirror-based optical redistribution has been developed in the AOP [14].…”

Section: Introductionmentioning

confidence: 99%

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Thermal Characteristics of Mirror-Based Optical Redistribution for Co-Packaged Optics

Nakamura

Suda

Kurosu

et al. 2023

J. Lightwave Technol.

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Because traffic toward and inside datacenters is increasing, the power consumption of electrical wiring in ethernet switches for datacenter should be addressed. Co-packaged optics (CPO) is a promising solution, where optical components are integrated into the same package substrate as electrical elements. We have proposed one of the CPO modules, where micro-mirrorbased optical redistribution is adopted for low-loss and broadband optical coupling. CPO is required to operate at high temperatures; however, this redistribution uses materials with different coefficients of thermal expansion; thus, there is concern about its operation. In this study, the thermo-optical characteristics in the C-band were analyzed by the finite element method for thermal deformation and physical optical propagation analysis. The coupling efficiency of more than 85 % was obtained at 1550 nm in the specified temperature range of 15-85 °C, and the difference in the average coupling loss between 20 °C and 85 °C was 0.49 dB in the calculation. The temperature-dependent transmittance was experimentally demonstrated using fabricated optical redistribution, and the average loss difference in C-band was 0.80 dB at 25 °C, 55 °C, and 85 °C.

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A surface-mount photonic package with a photonic-wire-bonded glass interposer as a hybrid integration platform for co-packaged optics

Uemura,

Misawa,

Mizuno

et al. 2024

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)

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Characterization of Optical Redistribution Loss Developed for Co-Packaged Optics

Cited by 6 publications

References 9 publications

Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics

Demonstration of Silicon-Photonics Hybrid Glass-Epoxy Substrate for Co-Packaged Optics

Thermal Characteristics of Mirror-Based Optical Redistribution for Co-Packaged Optics

A surface-mount photonic package with a photonic-wire-bonded glass interposer as a hybrid integration platform for co-packaged optics

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