mSCs with effectively increased capacitance and decreased device volume remains challenging.Over the past decade, various techniques such as photolithography, [6,7] laser-direct writing and laser etching, [8,9] printing and spray coating [10][11][12] have been successfully used to fabricate mSCs in fiber/yarn-based or planar interdigital forms. [13][14][15][16][17] Despite of these achievements, they suffer some inherent drawbacks. For instance, photolithography and printing methods are usually complicated and less powerful in constructing adaptable and transformable mSC systems. Meanwhile, the size and volume of interdigital mSCs obtained by laser-direct writing considerably increased after the integration of current collectors, supporting substrates, and packing materials, [18][19][20] a scenario that even became worse when a large number of mSCs were connected in series/parallel for practical applications. [21][22][23][24] In this work, we report a straightforward and versatile selfshrinkage assembling (SSA) strategy to directly fabricate compact mSC (CmSC). Aided by the surface tension of water during evaporation, the CmSC is spontaneously fabricated during the shrinkage of reduced graphene oxide (rGO) hydrogel slices with a layer of graphene oxide (GO) as the separator and conductive wires (e.g., gold, carbon fiber) as current collectors. The whole Microsized supercapacitors (mSCs) with small volume, rapid charge-discharge rate, and ultralong cyclic lifetime are urgently needed to meet the demand of miniaturized portable electronic devices. A versatile self-shrinkage assembling (SSA) strategy to directly construct the compact mSCs (CmSCs) from hydrogels of reduced graphene oxide is reported. A single CmSC is only 0.0023 cm 3 in volume, which is significantly smaller than most reported mSCs in fiber/yarn and planar interdigital forms. It exhibits a high capacitance of up to 68.3 F cm −3 and a superior cycling stability with 98% capacitance retention after 25 000 cycles. Most importantly, the SSA technique enables the CmSC as the building block to realize arbitrary, programmable, and multi-dimensional integration for adaptable and complicated power systems. By design on mortise and tenon joint connection, autologous integrated 3D interdigital CmSCs are fabricated in a self-holding-on manner, which thus dramatically reduces the whole device volume to achieve the high-performance capacitive behavior. Consequently, the SSA technique offers a universal and versatile approach for large-scale on-demand integration of mSCs as flexible and transformable power sources.With the rapid development of miniaturized and portable electronic devices, microsized supercapacitors (mSCs) with small space volume, rapid charge-discharge rate, and ultralong cyclic lifetime have captured enormous attention. [1][2][3] While the areal capacitance of mSCs has been well improved recently, their practical use is still hindered by the low volumetric capacitance resulted from the low packing density. [4,5] Therefore, fabricating