2020 IEEE International Solid- State Circuits Conference - (ISSCC) 2020
DOI: 10.1109/isscc19947.2020.9062953
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33.2 A Fully Integrated Analog ReRAM Based 78.4TOPS/W Compute-In-Memory Chip with Fully Parallel MAC Computing

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Cited by 167 publications
(85 citation statements)
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“…Using a single nanoscale PCM device to represent each component of a 512-bit vector leads to a very high density key memory. The key memory can also be realized using other forms of in-memory computing based on resistive random access memory 33 or even charge-based approaches 34 . There are also several avenues to improve the efficiency of the controller.…”
Section: Resultsmentioning
confidence: 99%
“…Using a single nanoscale PCM device to represent each component of a 512-bit vector leads to a very high density key memory. The key memory can also be realized using other forms of in-memory computing based on resistive random access memory 33 or even charge-based approaches 34 . There are also several avenues to improve the efficiency of the controller.…”
Section: Resultsmentioning
confidence: 99%
“…Although the macro can perform a convolutional neural network (CNN) with very low latency, the output of the memristor cell is only 1 bit which largely limits its performance. In 2020, a 160 kb memristor chip with a 2T2R active array was proposed [71], where 3-bit signed weight was used in one memristor cell. The chip is fully integrated for a complete multi-layer ANN and achieves 78.4 TOPS/W peak energy efficiency and 94.4% test accuracy in the MNIST dataset.…”
Section: Ai Chipmentioning
confidence: 99%
“…Typically, the synaptic weights in a neural network have a differential structure, thus two separate 1T1R memory devices are used for representing a single weight. This is shown in Figure 12a where two contiguous columns are used for representing positive and negative weights that are summed up in the digital domain [69]. This configuration results in a relatively large impact of the IR drop since two array locations are used for each matrix entry.…”
Section: Array-level Reliability Issuesmentioning
confidence: 99%
“…This configuration results in a relatively large impact of the IR drop since two array locations are used for each matrix entry. To mitigate this issues, Figure 12b shows a signed-weighted 2-transistor/2-resistor (SW-2T2R) structure to represent the positive and negative part of each weight, where the current summation is performed directly within the memory cell, thus effectively reducing the impact of IR drop by roughly a factor 2 [69]. Another approach is to use small-size crosspoint arrays and/or organize the IMC architecture in computing tiles [70,71], where the overall problem is divided in smaller operations with smaller summation currents, hence a lower IR drop.…”
Section: Array-level Reliability Issuesmentioning
confidence: 99%