238 x 238 micromechanical optical cross connect

Aksyuk, Vladimir A.; Arney, S.; Basavanhally, N.R.; Bishop, David J.; Bolle, C.; Chang, Chorng-Ping; Frahm, R.; Gasparyan, A.; Gates, J.V.; George, R.; Giles, C.R.; Kim, J.; Kolodner, Paul; Lee, T.M.; Neilson, David T.; Nijander, C.; Nuzman, C.; Paczkowski, Mark A.; Papazian, A.R.; Pardo, F.; Ramsey, David A.; Ryf, Roland; Scotti, R.E.; Shea, Herbert; Simon, M.E.

doi:10.1109/lpt.2003.809261

Cited by 61 publications

(18 citation statements)

References 6 publications

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“…Lucent inserted a Fourier lens between the two micromirror chips with the focal length equal to the Rayleigh range of the optical beam (Fig. 8) [50]. This reduces the required scan angle of the mirror.…”

Section: Three-dimensional Mems Switchesmentioning

confidence: 99%

Optical MEMS for Lightwave Communication

Solgaard

Ford

2006

J. Lightwave Technol.

305

141

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Abstract-The intensive investment in optical microelectromechanical systems (MEMS) in the last decade has led to many successful components that satisfy the requirements of lightwave communication networks. In this paper, we review the current state of the art of MEMS devices and subsystems for lightwave communication applications. Depending on the design, these components can either be broadband (wavelength independent) or wavelength selective. Broadband devices include optical switches, crossconnects, optical attenuators, and data modulators, while wavelength-selective components encompass wavelength add/drop multiplexers, wavelength-selective switches and crossconnects, spectral equalizers, dispersion compensators, spectrometers, and tunable lasers. Integration of MEMS and planar lightwave circuits, microresonators, and photonic crystals could lead to further reduction in size and cost.

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Section: Three-dimensional Mems Switchesmentioning

confidence: 99%

Optical MEMS for Lightwave Communication

Solgaard

Ford

2006

J. Lightwave Technol.

305

141

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“…If still higher levels of connectivity were desired, then micromechanical mirror arrays could be employed; here, well established devices exist which allow impressive levels of switching at only modestly higher loss. For example, a 2003 report describes a 238-to-238 switch with a typical loss of only 1.4dB [44].…”

Section: Optical Switchingmentioning

confidence: 99%

Minimally complex ion traps as modules for quantum communication and computing

et al. 2016

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Optically linked ion traps are promising as components of network-based quantum technologies, including communication systems and modular computers. Experimental results achieved to date indicate that the fidelity of operations within each ion trap module will be far higher than the fidelity of operations involving the links; fortunately internal storage and processing can effectively upgrade the links through the process of purification. Here we perform the most detailed analysis to date on this purification task, using a protocol which is balanced to maximise fidelity while minimising the device complexity and the time cost of the process. Moreover we 'compile down' the quantum circuit to device-level operations including cooling and shuttling events. We find that a linear trap with only five ions (two of one species, three of another) can support our protocol while incorporating desirable features such as global control, i.e. laser control pulses need only target an entire zone rather than differentiating one ion from its neighbour. To evaluate the capabilities of such a module we consider its use both as a universal communications node for quantum key distribution, and as the basic repeating unit of a quantum computer. For the latter case we evaluate the threshold for fault tolerant quantum computing using the surface code, finding acceptable fidelities for the 'raw' entangling link as low as 83% (or under 75% if an additional ion is available).

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“…However, the majority of through-wafer devices are torsion mirror switches, originally developed from resonant mirror scanners [54,55]. Arrays of two-axis tilt mirrors have been used in optical cross-connects with large port counts [56,57]. Improved optical performance has been obtained by replacing polysilicon mirrors with single crystal optical surfaces [58].…”

Section: Out-of-plane Componentsmentioning

confidence: 99%

Bsoi Moems

Syms

2005

SPIE Proceedings

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Micro-opto-electro-mechanical systems (MOEMS) typically require optical surfaces with high flatness and low roughness to be combined with high quality mechanical parts and low power, high force microactuators. In the past, attention has concentrated overwhelmingly on polysilicon surface micromachining, which allows an extremely flexible approach to the design of complex optical systems. However, polysilicon components typically suffer from poor surface flatness and high roughness, and lack the strength and rigidity to support and manipulate macroscopic optical components, which often have weights in the milligram range. Bonded silicon-on-insulator (BSOI) material provides an excellent alternative, allowing high optical quality to be combined with high mechanical strength. This paper will review a number of different approaches to BSOI MEMS, including deep reactive ion etching (for in-plane devices), double-sided processing (for through-wafer devices) and surface tension self-assembly (for 3D MOEMS). Applications ranging from variable optical attenuators to tunable laser systems will be described. Methods of mounting, aligning and fixing hybrid-integrated components will also be considered, together with appropriate high-force micro-actuators.

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238 x 238 micromechanical optical cross connect

Cited by 61 publications

References 6 publications

Optical MEMS for Lightwave Communication

Optical MEMS for Lightwave Communication

Minimally complex ion traps as modules for quantum communication and computing

Bsoi Moems

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