2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC) 2014
DOI: 10.1109/isscc.2014.6757443
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17.8 A 190nW 33kHz RC oscillator with ±0.21% temperature stability and 4ppm long-term stability

Abstract: In wireless networks with a low duty cycle, the radio is operational for only a small percentage of the time. A sleep timer is used to synchronize the data transmission and reception. The total system power is then limited by the sleep power and the sleep timer frequency stability. Low-frequency crystal oscillators are a common choice for sleep timers due to their excellent long-term stability, frequency stability over temperature, and very low power consumption. However, the external crystal cost and board ar… Show more

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Cited by 64 publications
(31 citation statements)
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“…7 shows the micro-photo of the tag chip, and the die size of the 16k bits EEPROM is 0.45 mm 2 , while the total tag chip area without test pad is 1 mm 2 . The energy storage capacitor Cs consumes a chip area of 0.28 mm 2 while the OSC including the calibration current array consumes a chip area of 0.0036 mm 2 , which is much smaller than the chip area OSC solution in [6] and [7]. The tag chip was packaged with a Chip-on-Board (COB) package and Flipchip package for function and performance test respectively.…”
Section: Measurement Resultsmentioning
confidence: 99%
See 2 more Smart Citations
“…7 shows the micro-photo of the tag chip, and the die size of the 16k bits EEPROM is 0.45 mm 2 , while the total tag chip area without test pad is 1 mm 2 . The energy storage capacitor Cs consumes a chip area of 0.28 mm 2 while the OSC including the calibration current array consumes a chip area of 0.0036 mm 2 , which is much smaller than the chip area OSC solution in [6] and [7]. The tag chip was packaged with a Chip-on-Board (COB) package and Flipchip package for function and performance test respectively.…”
Section: Measurement Resultsmentioning
confidence: 99%
“…However, these two solutions are featured by large frequency variation due to semiconductor process deviation. Without taking into the consideration of the process variation and the temperature coefficient of the resistor and capacitance, the OSC in [6] and [7] demonstrates a temperature frequency accuracy as small as AE0:21%. However, the frequency variation due to process drift is not provided.…”
Section: Realization Of the Oscillator Calibration Schemementioning
confidence: 99%
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“…On the other hand, a feed forward period control technique [3] was proposed to remove comparator and buffer delays. An inverter-based oscillator uses a zero temperature coefficient resistor and tracks threshold voltage variation to maintain both charging time and delay constant [4]. While these approaches achieve high accuracy (38.2 to 104ppm/°C in the kHz range), they consume 120nW to 4.5µW, which remains high relative to standby power in compact wireless sensors.…”
Section: Introductionmentioning
confidence: 99%
“…However, temperature compensation is required to meet the ±500ppm sleep timer requirement in the Bluetooth Smart standard. In both [2] and [3], a poly resistor with a dedicated temperature coefficient implant is used in the oscillator, which increases the process cost. In [2], frequency variation with supply is also large.…”
mentioning
confidence: 99%