2017 IEEE International Solid-State Circuits Conference (ISSCC) 2017
DOI: 10.1109/isscc.2017.7870333
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12.1 A 7nm 256Mb SRAM in high-k metal-gate FinFET technology with write-assist circuitry for low-V<inf>MIN</inf> applications

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Cited by 47 publications
(33 citation statements)
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“…The standard deviation of V TH in 45 nm CMOS process node reaches approximately 16 % of the mean value [10]. Other affected electrical parameters include parasitics of the chip interconnects, namely parasitic impedance and parasitic capacitance [11]. The characteristics of semiconductor structure alter with time, so electrical parameters of ICs are also affected by ageing.…”
Section: Robustness To Pvt Fluctuationsmentioning
confidence: 99%
“…The standard deviation of V TH in 45 nm CMOS process node reaches approximately 16 % of the mean value [10]. Other affected electrical parameters include parasitics of the chip interconnects, namely parasitic impedance and parasitic capacitance [11]. The characteristics of semiconductor structure alter with time, so electrical parameters of ICs are also affected by ageing.…”
Section: Robustness To Pvt Fluctuationsmentioning
confidence: 99%
“…However, the development of eNVMs remains at 22nm [6] or 40nm [7] thus lags behind the logic transistor scaling. Instead, SRAM is a mature embedded memory technology that is available at 7nm and beyond [8]. SRAM-CIM at 7nm provides higher density than 28nm RRAM-CIM (even with 4-bit per cell) [9].…”
Section: Introductionmentioning
confidence: 99%
“…The standard deviation of the transistor threshold voltage (V T H ) in 45 nm CMOS process node reaches approximately 16% of the mean value [2]. Other affected electrical parameters include parasitics of the chip interconnects, namely parasitic impedance and parasitic capacitance [3].…”
Section: Introductionmentioning
confidence: 99%