Influence of the microstructure on the electrochemical properties of Al-Cr-N coatings deposited by co-sputtering method from a Cr-Al binary target

Abstract

In the present paper, aluminum chromium nitride (Al-Cr-N) films were deposited onto AISI H13 steel substrates by a reactive d.c magnetron co-sputtering system in an atmosphere of Ar/N 2 (90/10) gas mixture from a binary target composed of chromium (99.95%) and aluminum (99.99%). Different powers (40, 50, 60, and 70 W) were applied to the target, in order to study the effect of this parameter and the sputtering yield of binary target, on the microstructure and the electrochemical properties of the Al-Cr-N coatings. The corrosion behavior in 3.5 wt. (%) NaCl solution was investigated by electrochemical corrosion tests (Tafel polarization curves and Electrochemical Impedance Spectroscopy (EIS)), and the chemical composition, microstructure and the absorption bands by means of Energy Dispersive X-ray Spectroscopy (EDX), X-ray diffractometry (XRD) and Fourier Transform Infrared Spectroscopy (FTIR), respectively. EIS results showed that the Al-Cr-N coating deposited at 40 W, exhibited the lower porosity and the highest polarization resistance, and subsequently, when the power applied to the binary target increased, the corrosion rate and the porosity increase.

Corrosion Properties of CrAlN and TiAlN Coatings Deposited by Thermoreactive Deposition Process

“…2, the CrAlN coated sample has got the highest E corr value which is coming upon the upper site of passive region of the uncoated and TiAlN coated AISI D2 steels, and current density of the CrAlN coated steel is lower than that of the uncoated and TiAlN coated steels. These electrochemical characteristics demonstrated the capacity of the TiAlN and CrAlN coating for providing corrosion protection to the underlying substrate [19,20]. Scanning electron micrographs (SEM) along with energy dispersive X-ray spectroscopy (EDS) analysis for TiAlN and CrAlN coatings are shown in Fig.…”

The effect of Ti and Si on the mechanical and electrochemical behaviors of the AlCrN coating deposited by CAPVD on 304SS

“…Finding the remarks of voids along the direction of coating growth is difficult. Figure 6 shows the presence of these voids (in the AT80 sample) that can be formed due to throwing macro‐particles out during the coating process and growing of coating around these induced sites or throwing macro‐particles out from coating surface at the last steps of coating 10,32 …”

“…According to the studies conducted on the impedance of nitride coatings deposited by cathode arc evaporation and a sputtering method, the same models have been reported to analyze the coating properties and to determine the equivalent circuit elements. 21,23,32,38 Based on this literature, the suitable equivalent circuit for substrate behavior is R (QR), and for coating, samples are R(C[R(RQ)]).…”

Tris‐(8‐hydroxyquinoline) aluminium thin film as saturable absorber for passively Q‐switched erbium‐doped fibre laser

“…In contrast, the Alq 3 embedded into PVA thin film shows similar FTIR spectrum as PVA thin film except for the appearance of three peaks at 2176, 1580, and 750 cm −1 . The 2176, 1580, and 750 cm −1 peaks correspond to Al-O-H, C = N, and Al-N modes for Alq 3 chemical bonding [46][47][48], respectively. The SEM image of Alq 3 :PVA thin film was also obtained as shown in Fig.…”