Influência de adições de prata na cinética de recristalização da liga CU-5%Al

Adorno, A. T.; Beatrice, Carlos Roberto Sobreira; Cilense, M.; Petroni, Ivan Alexandre; Hara, Aroldo Hiroiuqui

doi:10.1590/s0100-46702000000100005

Cited by 2 publications

(1 citation statement)

References 9 publications

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“…As the annealing temperature increased to 700 °C, the recrystallized grains grow. The addition of Ag can improve the softening resistance of Cu-Cr alloys, which is attributed to the fact that Ag atoms increase the recrystallization activation energy of copper alloys [21] and delay recrystallization and recrystallization grain growth during the softening process, and recrystallization is the main factor leading to alloy softening [19]。…”

Section: Softening Resistancementioning

confidence: 99%

Microstructure and softening resistance of Cu-Cr-Ag alloy

Wang

Huang

Zhang

et al. 2022

J. Phys.: Conf. Ser.

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In this paper, Cu-0.5Cr and Cu-0.5Cr-0.1Ag alloys were used as experimental materials to test the softening resistance of the alloys. The results show that the addition of Ag can improve the hardness and softening temperature of the Cu-Cr alloy, and has little effect on the conductivity. The softening resistance temperature of Cu-0.5Cr-0.1Ag alloy is 575 °C, which is 25 °C higher than that of Cu-0.5Cr alloy. The softening process of the alloy is accompanied by grain recovery, recrystallization and coarsening. Ag atom improves the recrystallization activation energy of copper alloy and delays the recrystallization and recrystallization grain growth in the softening process. Recrystallization is the main factor leading to the softening of the alloy.

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Section: Softening Resistancementioning

confidence: 99%

Microstructure and softening resistance of Cu-Cr-Ag alloy

Wang

Huang

Zhang

et al. 2022

J. Phys.: Conf. Ser.

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Effect of Ag on Properties, Microstructure, and Thermostability of Cu–Cr Alloy

Sun

Feng³

et al. 2020

Materials

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Cu–Cr-based alloys exhibit excellent electrical conductivity and strength, but their poor thermal stability limits their application in industry. In this paper, Cu–0.2Cr (at. %) and Cu–0.2Cr–0.12Ag (at. %) alloys were prepared to study the effect of Ag on the properties, microstructure, and thermal stability of the Cu–Cr alloy. Microstructure and precipitation were observed by an optical microscope (OM) and a transmission–electron microscope (TEM). After cold-drawing by 99.9% and aging at 450 °C for 2 h, the peak hardness and electric conductivity of the Cu–Cr alloy were 120.3 HV and 99.5% IACS, respectively, and those of the Cu–Cr–Ag alloy were 135.8 HV and 98.3% IACS, respectively. The softening temperature of the Cu–Cr alloy was 500~525 °C, and that of the Cu–Cr–Ag alloy was about 550 °C. The creep strains of the Cu–Cr and Cu–Cr–Ag alloys at 40 MPa and 400 ℃ for 50 h were 0.18% and 0.05%, respectively. Ag elements improved the thermal stability of the Cu–Cr alloy. Recovery and recrystallization occurred before the coarsening of precipitates during the softening process. Ag atoms mainly improved the softening resistance of the alloy by delaying recrystallization, and mainly increased creep resistance by preventing the increase in mobile-dislocation density.

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Influência de adições de prata na cinética de recristalização da liga CU-5%Al

Cited by 2 publications

References 9 publications

Microstructure and softening resistance of Cu-Cr-Ag alloy

Microstructure and softening resistance of Cu-Cr-Ag alloy

Effect of Ag on Properties, Microstructure, and Thermostability of Cu–Cr Alloy

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