Microstructure and softening resistance of Cu-Cr-Ag alloy

Abstract

In this paper, Cu-0.5Cr and Cu-0.5Cr-0.1Ag alloys were used as experimental materials to test the softening resistance of the alloys. The results show that the addition of Ag can improve the hardness and softening temperature of the Cu-Cr alloy, and has little effect on the conductivity. The softening resistance temperature of Cu-0.5Cr-0.1Ag alloy is 575 °C, which is 25 °C higher than that of Cu-0.5Cr alloy. The softening process of the alloy is accompanied by grain recovery, recrystallization and coarsening. Ag atom improves the recrystallization activation energy of copper alloy and delays the recrystallization and recrystallization grain growth in the softening process. Recrystallization is the main factor leading to the softening of the alloy.