2004
DOI: 10.1109/lpt.2004.832592
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1.55-<tex>$mu$</tex>m Optically Pumped Wafer-Fused Tunable VCSELs With 32-nm Tuning Range

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Cited by 17 publications
(9 citation statements)
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“…In this case, mechanical alteration of the effective FP mode gives rise to tuning ranges greater than those that can be achieved by refractive index modulation. Recently, both electrically and optically pumped vertical-cavity surface-emitting lasers (VCSELs) with 30-nm single-mode tuning ranges have been demonstrated [7], [8]. We report here the first widely tunable semiconductor optical amplifier, using a MEMS-based tuning element to sweep the narrow gain bandwidth of the VCSOA over the wavelength span of the device, resulting in tunable channel-selective amplification [9].…”
Section: Introductionmentioning
confidence: 99%
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“…In this case, mechanical alteration of the effective FP mode gives rise to tuning ranges greater than those that can be achieved by refractive index modulation. Recently, both electrically and optically pumped vertical-cavity surface-emitting lasers (VCSELs) with 30-nm single-mode tuning ranges have been demonstrated [7], [8]. We report here the first widely tunable semiconductor optical amplifier, using a MEMS-based tuning element to sweep the narrow gain bandwidth of the VCSOA over the wavelength span of the device, resulting in tunable channel-selective amplification [9].…”
Section: Introductionmentioning
confidence: 99%
“…Although little previous work has focused specifically on MEMS-tunable VCSOAs (MT-VCSOAs), a number of research groups have developed a variety of other MEMS-tunable vertical-cavity devices, including VCSELs [7], [8], [13]- [15], resonant-cavity light-emitting diodes (RCLEDs) [16], asymmetric FP modulators [17], and vertical-cavity filters [18]. The majority of these structures have utilized electrostatic tuning, although thermal tuning is also frequently used [7].…”
Section: Introductionmentioning
confidence: 99%
“…Over the past 10 years, direct wafer bonding has received considerable attention for releasing the restrictions of lattice matching imposed by epitaxial growth and opening new degrees of freedom for the design of semiconductor devices [1][2][3][4][5][6][7][8][9][10]. During the wafer bonding process, thermal treatment is a very important step, which increases the surface energy and bonding strength of the bonded wafers [11].…”
Section: Introductionmentioning
confidence: 99%
“…All the known features of typical VCSELs, including capacity for integration into two-dimensional arrays, testability, low-power dissipation and low-divergence circular output beams, are compatible with the emerging market of high speed optical communications (Geske et al 2004). In these systems, there is a broadband multichannel configuration, which can be usually achieved by means of laser arrays (Chang-Hasnain et al 1991;Geske et al 2004) or tunable devices (Syrbu et al 2004;Sun et al 2004;Tarraf et al 2004). In both cases out-of-band emission characteristics become as important as inside channel operation when analysing the global system (Filios et al 2003;Prott et al 2003).…”
Section: Introductionmentioning
confidence: 99%