To improve the wear resistance of Cu/Ni multilayer films, a Cu-Sn-Ni alloy boundary layer was formed between Cu/Ni layers through repeated electrochemical deposition of Cu, Sn, and Ni, and by annealing of the Cu/Sn/Ni/Sn multilayer film. The wear resistance of the annealed Cu/Sn/Ni/Sn film was higher than that of the Cu/Ni film, but the wear resistance of a single layer of Sn is much lower than those of Cu and Ni. The XRD and XPS measurements of the annealed Cu/Sn/Ni/Sn film indicated that the Cu-Sn-Ni alloy was Cu 2 Sn 3 Ni 3 alloy, with Sn atoms distributed at the interface of Cu/Ni layers. Results suggest that an increase in adhesion of Cu and Ni layers with the boundary layers improved the wear resistance of multilayer films.
Several Ni-P/Cu multilayer films of various thicknesses were formed on polycrystalline copper substrates using electrodeposition in a single bath. The Ni-P/Cu bilayer films which were thinner than 50 nm exhibited higher wear resistance than that of a Ni-P single layer. The wear loss of the films decreased concomitantly with increasing Ni-P layer ratio in the Ni-P/Cu bilayer.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.