2012
DOI: 10.4139/sfj.63.769
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The Effect of Cu-Sn-Ni Alloy Boundary Layer on Wear Resistance Property of Electrodeposited Cu/Ni Multilayer Films

Abstract: To improve the wear resistance of Cu/Ni multilayer films, a Cu-Sn-Ni alloy boundary layer was formed between Cu/Ni layers through repeated electrochemical deposition of Cu, Sn, and Ni, and by annealing of the Cu/Sn/Ni/Sn multilayer film. The wear resistance of the annealed Cu/Sn/Ni/Sn film was higher than that of the Cu/Ni film, but the wear resistance of a single layer of Sn is much lower than those of Cu and Ni. The XRD and XPS measurements of the annealed Cu/Sn/Ni/Sn film indicated that the Cu-Sn-Ni alloy w… Show more

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Cited by 4 publications
(2 citation statements)
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“…4,5) This composition-modulated Co-Ni laminated plating is available to produce by periodically varying stirring conditions during film formation in a single bath. Many of the studies [6][7][8][9][10][11][12] have been reported on the plating films consisted of the conventional metal multilayer films, but laminated structure producing required lamination in the plural different tanks or pulse electric plating as well as due to complicated manufacturing process, so that they are difficult to be put into industrial practice. In addition, there are many studies on the thickness of the constituent layers at the nanometer level, but there are few reports on thick films laminated with micrometer-level layers.…”
Section: Pp 426-432; J-stage Advance Published Date: August 23 2019)mentioning
confidence: 99%
“…4,5) This composition-modulated Co-Ni laminated plating is available to produce by periodically varying stirring conditions during film formation in a single bath. Many of the studies [6][7][8][9][10][11][12] have been reported on the plating films consisted of the conventional metal multilayer films, but laminated structure producing required lamination in the plural different tanks or pulse electric plating as well as due to complicated manufacturing process, so that they are difficult to be put into industrial practice. In addition, there are many studies on the thickness of the constituent layers at the nanometer level, but there are few reports on thick films laminated with micrometer-level layers.…”
Section: Pp 426-432; J-stage Advance Published Date: August 23 2019)mentioning
confidence: 99%
“…Electrochemistry, 83 (8), 624-629 (2015) Ni /Cu 多層膜に関する XRD 測定結果 (Fig. 9) に関して も同様の考察ができる.Ni(100 nm) / Cu(100 nm) …”
unclassified