This paper presents an efficient analytical solution strategy to determine the adhesive stresses in balanced and unbalanced adhesively bonded joints with mixed force loading and/or displacement boundary conditions. The adhesive stresses are expressed in terms of geometrical dimensions and material properties, combined with integration constants obtained numerically. The model is successfully applied for the analysis of various types of joints, including balanced and unbalanced stiffened plate/joint, single-strap joint, and single-lap joint. In all such cases, the linear equation sets are supplied to determine the integration constants in the final stress expressions. The analytical predictions agree well with the finite element results for adhesive stresses. This proposed model can be extended conveniently to predict the mechanical behavior of similar bonded structures such as composite laminates, electronics packaging, and flexible electronics structures
Flip chip packaging as a mainstream packaging interconnect technology has proliferated rapidly within the last decade or so. With the applications of high-performance chip, its thickness and size have been much thinner and bigger, which is challenging the current assembly technique, especially for the reliable peeling of ultrathin die from the wafer due to its vulnerability and flexibility. Here, we present some significant analytical formulas to estimate die cracking stress and peeling energy in die peeling process. The effects of two factors, including peeling cracking propagation and ejecting needle configuration, are investigated using a fracture mechanics framework. Meanwhile, all analytical predictions have been verified via finite element modeling with virtual crack technique. Theoretical results have shown that die cracking stress could be effectively reduced, but it rarely works to improve peeling energy when more needles are embedded below the adhesive tape. In particular, the essence of the technique with the multineedle is discussed, compared with the normal single-needle technique, which can be used to guide the design of ultrathin die peeling process.Index Terms-Adhesive layer, chip peeling-off, die-cracking stress, energy release rate (ERR), microelectronic packaging, multineedle ejector.
The paper presents a mechanical model for predicting the cohesive failure of a periodic array of integrated circuit (IC) chips adhesively bonded to a stretched substrate. A unit cell of the layered structure consisting of the IC chips, adhesive layer, and substrate is modeled as an assembly of two elastic Timoshenko beams, representing the chip and substrate, connected by an elastic interface, representing the adhesive. Accordingly, the stresses and energy release rate (ERR) in the adhesive layer – responsible for the premature cracking of the adhesive and debonding of the IC chips – are identified with the corresponding quantities computed for the elastic interface. Expressions for the adhesive stresses and ERR are given in terms of geometrical dimensions and material properties, combined with integration constants obtained numerically via the multi-segment analysis method. For comparison, the stresses in the adhesive are also computed based on a finite element model, and the ERR is evaluated using the virtual crack-closure technique (VCCT). The analytical predictions and numerical results match fairly well, considering the effects of key factors, such as the distance between adjacent chips, the chip size, the material properties of adhesive and substrate. The interaction between the chips is shown to have relevant effects on the adhesive stresses. In particular, only the mode II contributes to the ERR which increases with the ratio of the chip size to the distance between the chips and with the compliance of the adhesive and substrate layers
The precise evaluation of fracture strength of ultrathin (<50 μm thick) silicon chips/ribbons plays a critical role in design of deformability and lifetime of flexible/stretchable electronics. In its three-point bending test, however, the classical linear theory used to convert the experimental fracture load into fracture strength value fails to match the emerged geometrically nonlinear characteristics for such an ultrathin silicon die. Here, we consider the geometric large deformation and present its nonlinear solution to more reliably evaluate the fracture stress of ultrathin specimen by virtue of the obtained experimental fracture load. A quite good agreement on experiments shows that the nonlinear analytical predictions allow a more comprehensive understanding for the effects of the silicon samples' thickness on the transformation from linear relation to nonlinearity. The comparisons indicate that the fracture strength values are lower from linear evaluations, and to this the corresponding correction factor is defined to enhance the estimate precision.
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