SURFACE ROUGHNESS AND GRAIN SIZE CHARACTERIZATION OF ANNEALING TEMPERATURE EFFECT FOR GROWTH GALLIUM ANDTANTALUM DOPED Ba 0.5 Sr 0.5 TiO 3 THIN FILM. Thin films 10 % gallium oxide doped barium strontium titanate (BGST) and 10 % tantalum oxide doped barium strontium titanate (BTST) were prepared on p-type Si (100) substrates using chemical solution deposition (CSD) method with 1.00 M precursor. The films were deposited by spin coating method with spinning speed at 3000 rpm for 30 seconds. The post deposition annealing of the films were carried out in a furnace at 200 o C, 240 o C, 280 o C (low temperature) for 1 hour in oxygen gas atmosphere. The surface roughness and grain size analysis of the grown thin films are described by atomic force microscope (AFM) method at 5000 nm x 5000 nm area. The rms surface roughness BGST thin films at 5000 nm x 5000 nm area are 0. o C would result in decreasing the rms roughness and grain size. Therefore, rms roughness and grain size would have the strong correlation annealing temperature.
Surface plasmon resonance (SPR) sensors have been widely adopted with various fields such as phy sics, chemistry, biology and biochemistry. SPR sensor has many advantages like the less number of sensing samples required, freedom of electromagnetic interference and higher sensitivity. This research invest igates the phase interrogation technique of a surface plasmon resonance sensor based on silver and thin film dielectric material of Barium titanate layers. Barium titanate (BaTiO3) layer is adopted due to its excellent dielectric properties such as high dielectric constant and low dielectric loss. The numerical results demonstrate that the fusion of the proposed material BaTiO3 layer into surface plasmon resonance sensor yields a higher sensitivity of 280 degree/RIU in comparison with surface plasmon resonance sensor without BaTiO3 layer which shows only a sensitivity of 120 degree/RIU. As the thickness of this layer increases from 5 nm to 10 nm, the sensitivity is enhanced from 160 degree/RIU to 280 degree/RIU for a fixed metal layer of silver with a thickness of (70 nm).
Purpose -The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array (BGA) package. Design/methodology/approach -Thermal cycling test has been used to evaluate the reliability or fatigue life of the solder joints in BGA package using commercially available FEA software, ANSYSe. The effect of different temperature cycling condition is studied by applying different value of dwell time and ramp rate. Two types of analyses are used namely, the physics-based analysis and the statistical-based analysis. Two screening design methods namely, central composite design (CCD) and Box-Behnken Matrix Design method are used to isolate the most important factors amongst six selected design variables. The optimization process is carried out using response surface methodology (RSM). Findings -It is observed that changes in ramp rate produce significant effect in solder fatigue life than changes in dwell time but the dwell time at high temperature has a negligible contribution to solder fatigue life. It has been found that the thickness of the mold has a significant effect on the performance of the solder joint reliability (more than 50 percent) as compared to that from other factors. Besides, the effect of individual factor, the interaction among factors also changes the solder joint reliability. RSM based on Box-Behnken Matrix design offers the highest characteristic solder joint fatigue life with a value of 2,861 cycles. Originality/value -This paper provides a comprehensive method to evaluate the reliability of solder joints in terms of physics and statistical-based analysis.
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