Temperature cycling analysis for ball grid array package using finite element analysis

Abstract

Purpose -The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array (BGA) package. Design/methodology/approach -Thermal cycling test has been used to evaluate the reliability or fatigue life of the solder joints in BGA package using commercially available FEA software, ANSYSe. The effect of different temperature cycling condition is studied by applying different value of dwell time and ramp rate. Two types of analyses are used namely, the physics-based analysis and the statistical-based analysis. Two screening design methods namely, central composite design (CCD) and Box-Behnken Matrix Design method are used to isolate the most important factors amongst six selected design variables. The optimization process is carried out using response surface methodology (RSM). Findings -It is observed that changes in ramp rate produce significant effect in solder fatigue life than changes in dwell time but the dwell time at high temperature has a negligible contribution to solder fatigue life. It has been found that the thickness of the mold has a significant effect on the performance of the solder joint reliability (more than 50 percent) as compared to that from other factors. Besides, the effect of individual factor, the interaction among factors also changes the solder joint reliability. RSM based on Box-Behnken Matrix design offers the highest characteristic solder joint fatigue life with a value of 2,861 cycles. Originality/value -This paper provides a comprehensive method to evaluate the reliability of solder joints in terms of physics and statistical-based analysis.

Finite Element Analysis of Thermoelectric Generator with Aluminum Plate for Waste Heat Recovery Application

“…This finding also suggested that the Al width can be relaxed on developing the proposed TEG since it has the least effect on the output power. It is known that the development or manufacturing cost of a product can be reduced when the selected factors have the least accuracy tolerance or for this case the least sensitive factor of Al width [22].…”

Optimization of solder joints in embedded mechatronic systems via Kriging-assisted CMA-ES algorithm

“…The chosen Kriging uses a Gaussian correlation function and a quadratic basis function. Thus, to build Kriging metamodel, there are n k required points, which are a number of free parameters in quadratic basis function, n k ¼ p ¼ 1 2 ðn þ 1Þðn þ 2Þ. Consequently, the approximate ranking procedure will be performed in case the number of required points is assured, otherwise, the number of points jT j in the training set is more or equal to n k .…”

“…Thermal cycling test is one of the most commonly used reliability tests to assess thermo-mechanical reliability of the solder joints. The purpose of this test is to investigate the aptitude of solder joints to support mechanical stresses which is a major failure mechanism that can lead to solder joint fatigue failure [1][2][3][4][5]. The Thermo-mechanical stresses induced by alternating thermal cycles [6] are mainly induced by thermal expansion mismatch of different materials in assembly system.…”

Effects of different temperature profile on solder joints in PBGA packages

“…Solder joints' fatigue life in thermal cycling tests has been studied for decades using the finite element method. While many researchers are investigating the influence of thermal cycling on the reliability, it is still a heating-concerned problem to be discussed [4][5][6][7][8]. Xuejun Fan [9] found that the ramp rate, the dwell time, and the frequency of thermal cycling have a great impact on the reliability.…”