Sustainable and smart thermal management in modern wearable electronics is becoming increasingly important for developing the reliability and preventing premature failure of electronics. In this work, we report on the development of a new type of nanocomposite based on highly oriented graphite nanoplatelets (GNPs) that is functional as a thermal substrate with enhanced thermal conductivity and efficient cooling effect via a manufacturable process. Firstly, GNP/CMC (sodium carboxymethyl cellulose) nanocomposite films (GMFs) were fabricated in mass industry available level by gap coating method, in which GNPs were well preferred due to the driving interface wettability and interaction of CMC, resulting in high in-plane thermal conductivity. Then, GNP/CMC thermal plates (GTPs) with enhanced thermal conductivity (∼29.5 W (m K) −1 ) and a low density (1.14 g cm −3 ) were produced using as-prepared GMFs and epoxy as fillers and adhesive by lamination and hot pressing method, thus exhibiting an outstanding heat dissipation on electronic cooling. Under a chip power of 1-3 W, the temperature of chip attached on our GTP substrates can be 18.9∼47.7 °C lower than that on classic polycarbonates (PC) substrate. The obtained boosted thermal conductance of GTPs is primarily attributed to their biomimetic 'brick-wall' microstructure with GMFs and epoxy as brick and cement, which is the same as the structure of shell with mineral and protein as brick and cement, respectively. With enhanced thermal conductivity and manufacturability, our work Nanotechnology Nanotechnology 30 (2019) 245204 (12pp)
graphic contrast analysis. In some crystals inclusion like features were observed in the topographs. These are apparently inclusions of the flux materials.
The scanning electron microscope (SEM) based nanoprobing technique has established itself as an indispensable failure analysis (FA) technique as technology nodes continue to shrink according to Moore's Law. Although it has its share of disadvantages, SEM-based nanoprobing is often preferred because of its advantages over other FA techniques such as focused ion beam in fault isolation. This paper presents the effectiveness of the nanoprobing technique in isolating nanoscale defects in three different cases in sub-100 nm devices: soft-fail defect caused by asymmetrical nickel silicide (NiSi) formation, hard-fail defect caused by abnormal NiSi formation leading to contact-poly short, and isolation of resistive contact in a large electrical test structure. Results suggest that the SEM based nanoprobing technique is particularly useful in identifying causes of soft-fails and plays a very important role in investigating the cause of hard-fails and improving device yield.
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