In this work, intrinsic and p-type ZnO nanowires (NWs) have been synthesized. Pure intrinsic ZnO nanowires have been fabricated by direct oxidation method and their aspect ratio reached up to 271.3. Sb-doped ZnO nanowires were uniformly grown on Si substrates by chemical vapor deposition with diameters ranging from 0.5 to 5 μm and lengths ranging from 100 μm to 3 mm. Directional arrangement of nanowires has been realized by two self-assembly methods, pulling method and water flow method, and two kinds of ZnO nanodevices (strain sensor and homogenous p–n junction) were prepared and characterized based on the directional arranged nanowires. According to the current response of ZnO nanowire strain sensor, the deformation quantities of elastic plate under the action of external forces in orthogonal X and Y direction were calculated respectively. The ZnO nanowire homogenous p–n junction was made of two vertical Sb-doped and intrinsic ZnO nanowires. The I–V characteristic curve showed good rectification characteristics, and the forward turn-on voltage was about 10 V. However, since the current was too small due to the small carrier concentration in the ZnO single crystal, it is difficult to achieve electroluminescence at present.
Due to the harsh working environments up to 600 °C,
the exploration
of high-temperature interconnection materials is significantly important
for high-power devices. In this study, a hybrid paste including Cu@Ag
core–shell microparticles (MPs) and Ag nanoparticles (NPs)
was designed to achieve Cu–Cu bonding. The Cu@Ag MPs exhibited
excellent oxidation stability in an air atmosphere with the Ag layer
coating on the Cu core. Ag NPs fill the pores among the Cu@Ag MPs
and reduce the sintering temperature of the hybrid paste. The Cu–hybrid
paste–Cu joints were formed via electromagnetic induction heating
within approximately 15 s. When sintered at 26 kW, the shear strength
of the joint reached 48 MPa, the porosity decreased to 0.73%, and
the resistivity was down to 13.25 μΩ·cm. Furthermore,
a possible interconnection mechanism at the contact interface between
the Cu substrate and the sintered hybrid paste was proposed, which
is related to the melting point of metal particles and the effect
of magnetic eddy currents. This fast bonding technology inspires a
new approach to interconnection for high-power devices under high
operation temperatures.
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