Three-dimensional (3D) vertical architecture transistors represent an important technological pursuit, which have distinct advantages in device integration density, operation speed, and power consumption. However, the fabrication processes of such 3D devices are complex, especially in the interconnection of electrodes. In this paper, we present a novel method which combines suspended electrodes and focused ion beam (FIB) technology to greatly simplify the electrodes interconnection in 3D devices. Based on this method, we fabricate 3D vertical core-double shell structure transistors with ZnO channel and Al2O3 gate-oxide both grown by atomic layer deposition. Suspended top electrodes of vertical architecture could be directly connected to planar electrodes by FIB deposited Pt nanowires, which avoid cumbersome steps in the traditional 3D structure fabrication technology. Both single pillar and arrays devices show well behaved transfer characteristics with an I on/I off current ratio greater than 106 and a low threshold voltage around 0 V. The ON-current of the 2 × 2 pillars vertical channel transistor was 1.2 μA at the gate voltage of 3 V and drain voltage of 2 V, which can be also improved by increasing the number of pillars. Our method for fabricating vertical architecture transistors can be promising for device applications with high integration density and low power consumption.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.
customersupport@researchsolutions.com
10624 S. Eastern Ave., Ste. A-614
Henderson, NV 89052, USA
Copyright © 2024 scite LLC. All rights reserved.
Made with 💙 for researchers
Part of the Research Solutions Family.