Diamond-like carbon (DLC) films, which are amorphous carbon films, have been used as hard-coating films for protecting the surface of mechanical parts. Nitrogen-containing DLC (N-DLC) films are expected as conductive hard-coating materials. N-DLC films are expected in applications such as protective films for contact pins, which are used in the electrical check process of integrated circuit chips. In this study, N-DLC films are prepared using the T-shaped filtered arc deposition (T-FAD) method, and film properties are investigated. Film hardness and film density decreased when the N content increased in the films because the number of graphite structures in the DLC film increased as the N content increased. These trends are similar to the results of a previous study. The electrical resistivity of N-DLC films changed from 0.26 to 8.8 Ω cm with a change in the nanoindentation hardness from 17 to 27 GPa. The N-DLC films fabricated by the T-FAD method showed high mechanical hardness and low electrical resistivity.
Nitrogen-containing diamond-like carbon (N-DLC) multilayer films approximately 500 nm thick were fabricated on tungsten carbide substrates as surface protective films with high wear-resistive and conductive properties. Each layer thickness of the N-DLC multilayer films was approximately 10 nm, and the films were a periodic bilayer structure consisting of hard and soft N-DLC layers. Owing to the high abrasion resistance of the hard layer and the low aggressiveness and high adhesion of the soft layer, the multilayer films showed good polishing and wear resistances compared with the hard N-DLC monolayer film, and the electrical resistivity was about half. In the case of DLC multilayer films consisting of hard N-free DLC and N-DLC films, the decrease of each layer thickness leads to the reduction of the polishing resistance. From X-ray reflectivity analysis of ultra-thin N-free DLC films, it was indicated that the film density of an ultra-thin N-free DLC film is lower than that of a thick N-free DLC film. In the DLC multilayer film with thin N-free DLC layers, it is possible that the polishing resistance of the whole DLC film reduced because the hardness the N-free DLC layer was decreased due to the low film density of each N-free DLC layer.
Abstract. Materials with poor adhesion present a problem for the application of diamond-like carbon (DLC) films. As a method for solving this problem, there is a technique that deposits an interlayer of metal between the DLC film and substrate. A tungsten carbide film (W-C film) is used as the interlayer. In this study, the effect of introducing the W-C interlayer on the adhesion of the DLC film was investigated. The W-C films were deposited using two types of cemented tungsten carbides (WCs) as the cathode, one containing Co (WC-Co) and the other containing Ti (WC-Ti), as a binder for forming the cathode shape. It is necessary to control the film thickness of the interlayer to introduce the interlayer to the DLC film. The film thickness control of W-C films became possible by using a discharge counter. DLC films were deposited using a bias voltage of -100 V. The film thicknesses of the W-C interlayer and DLC film at the time of investigating adhesion were 30 nm and 300 nm, respectively. The result of the tape-peeling test showed that the adhesion of the DLC film was improved by employing the W-C interlayer. In addition, adhesion was further improved by removing the oxide layer on the intermediate layer.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.