2018
DOI: 10.1063/1.5021937
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Preparation of multi-layer film consisting of hydrogen-free DLC and nitrogen-containing DLC for conductive hard coating

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Cited by 7 publications
(2 citation statements)
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“…For example, to create an effective thermoelectric converter based on a three-layer carbon structure dielectric-conductor-dielectric [43]. Conductive periodic ta-C/a-CN eight-layer films have potential application as protective films for contact pins used in the electrical inspection process for integrated circuit chips [44]. In this case, subsequent annealing in vacuum should significantly increase the electrical conductivity of a-CN layers and relieve internal compression stresses in ta-C layers without deterioration of operational properties.…”
Section: Discussionmentioning
confidence: 99%
“…For example, to create an effective thermoelectric converter based on a three-layer carbon structure dielectric-conductor-dielectric [43]. Conductive periodic ta-C/a-CN eight-layer films have potential application as protective films for contact pins used in the electrical inspection process for integrated circuit chips [44]. In this case, subsequent annealing in vacuum should significantly increase the electrical conductivity of a-CN layers and relieve internal compression stresses in ta-C layers without deterioration of operational properties.…”
Section: Discussionmentioning
confidence: 99%
“…This effect can be minimized by the decrease of the carbon transition layer thickness. On the other hand, the suppression of the carbon transition layer may be unsuitable for adhesion, since a thin sp 2 -rich layer can help to reduce the interface stress (IIJIMA et al, 2018). Ha et al (2006) reported benefits in adhesion when an additional control layer of low stress was added under H-free a-C.…”
Section: Adhesion Testmentioning
confidence: 99%