International audienceThe collective representation within global models of aerosol, cloud, precipitation, and their radiative properties remains unsatisfactory. They constitute the largest source of uncertainty in predictions of climatic change and hamper the ability of numerical weather prediction models to forecast high-impact weather events. The joint ESA-JAXA EarthCARE satellite mission, scheduled for launch in 2017, will help to resolve these weaknesses by providing global profiles of cloud, aerosol, precipitation, and associated radiative properties inferred from a combination of measurements made by its collocated active and passive sensors. EarthCARE will improve our understanding of cloud and aerosol processes by extending the invaluable dataset acquired by the A-Train satellites CloudSat, CALIPSO, and Aqua. Specifically, EarthCARE's Cloud Profling Radar, with 7 dB more sensitivity than CloudSat, will detect more thin clouds and its Doppler capability will provide novel information on convection, precipitating ice particle and raindrop fall speeds. EarthCARE's 355-nm High Spectral Resolution Lidar will measure directly and accurately cloud and aerosol extinction and optical depth. Combining this with backscatter and polarization information should lead to an unprecedented ability to identify aerosol type. The Multi-Spectral Imager will provide a context for, and the ability to construct the cloud and aerosol distribution in 3D domains around the narrow 2D retrieved cross-section. The consistency of the retrievals will be assessed to within a target of ±10 W m⁻² on the (10 km²) scale by comparing the multi-view Broad-Band Radiometer observations to the top-of-atmosphere fluxes estimated by 3D radiative transfer models acting on retrieved 3D domains

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In-situ filament observations were carried out on the Cu/MoOx/TiN resistive random access memory (ReRAM) by using transmission electron microscopy. Multiple positive and negative I-V cycles were investigated. Clear set-reset bipolar switch corresponding to the characteristics of conventional ReRAM devices was recognized. Filament grew from TiN to Cu in the set cycle and shrank from TiN to Cu in the reset cycle. However, there was no clear contrast change in the image at the switching moment, and thus, switching is thought to occur in a local region of the filament. When the current was large at reset, the filament shrank much, and its position tended to change.

O and NO showed a cosine angular distribution and a Maxwellian velocity distribution at the surface temperature. On the other hand, the N 2 desorption collimated sharply at Ϯ41°-43°off the surface normal in a plane along the ͓001͔ direction. Then the velocity distributions of N 2 involved two hyperthermal components with the mean translational energy of 0.47 and 0.22 eV, respectively. A mechanism for the inclined N 2 desorption was proposed to be due to a highly exothermic reaction of N 2 O͑ad͒→N 2 (g)ϩO͑ad͒ and the strong repulsive force operative on the product N 2 from the surface.

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In-situ transmission electron microscopy (in-situ TEM) was performed to investigate the switching operation of a resistive random access memory (ReRAM) made of copper, tungsten oxide and titanium nitride (Cu/WOx/TiN). In the first Set (Forming) operation to initialize the device, precipitation appeared inside the WOx layer. It was presumed that a Cu conducting filament was formed, lowering the resistance (on-state). The Reset operation induced a higher resistance (the off-state). No change in the microstructure was identified in the TEM images. Only when an additional Reset current was applied after switching to the off-state could erasure of the filament be seen (over-Reset). Therefore, it was concluded that structural change relating to the resistance switch was localized in a very small area around the filament. With repeated switching operations and increasing operational current, the WOx/electrode interfaces became indistinct. At the same time, the resistance of the off-state gradually decreased. This is thought to be caused by Cu condensation at the interfaces because of leakage current through the area other than through the filament. This will lead to device degradation through mechanisms such as endurance failure. This is the first accelerated aging test of ReRAM achieved using in-situ TEM.

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