Aquatic environments and water resources face a variety of risks from numerous sources of pollution. In this paper, we propose a preliminary mechanism for realizing robotic technology practically and cost-effectively for monitoring these pollutions. The presented system is a small robotic fish propelled by a beam of ionic polymer-metal composite (IPMC) artificial muscle that imitates the motion of a small Scorpis Georgiana fish. One of the superiorities of the proposed model is the IPMC actuation mechanism powered by a battery that is charged wirelessly from a solar panel source. This approach enables us to produce a robotic fish that works ceaselessly without being forced to carry the solar panel load. Moreover, we present a method to control the flapping motion of a robotic fish by taking advantage of a tiny Wi-Fi module that yields more working range, bulky data sending, low power consumption, simple programing, and convenient communication for creating a network with other similar robots. All these beneficial characteristics make the proposed structure a promising candidate for detecting pollution on the surface of aquatic environments and sending/recording necessary data in collaboration with desirable sensors. Theoretical considerations support experimental results reported in the paper.
Silicon interconnect fabric (Si-IF) is a wafer-scale heterogeneous integration platform. This platform promotes a paradigm shift in system integration and packaging methods, providing a single hierarchy of integration between the dies and the platform. The Si-IF effectively replaces the interposer, package, and printed circuit board. A power delivery methodology for high power wafer-scale systems (expected to dissipate up to 50 kW of power) is proposed in this paper. The proposed methodology includes three distinct power distribution topologies that are compared in terms of power loss, thermal consideration, and manufacturability. Compatible applications for each topology are also discussed. The electrical model, IR drop, and Ldi/dt noise, of each power distribution topology, are extracted and compared. Assuming a load voltage of 1 V, the three topologies exhibit a total voltage drop of, respectively, 16.68 mV, 9.62 mV, and 12.28 mV, corresponding to, respectively, 1.67%, 0.96%, and 1.23%. Hierarchical integration of decoupling capacitors is also described to ensure low voltage ripple (<5%) at the point of load. The electrical models of the power distribution topologies are verified using FEM and SPICE simulations.
The key challenges of on‐chip integration, including limited scalability, high cost, difficulty to maintain profitable yield, and increased thermal management complexity, suggest that additional avenues for scaling should be explored. Wafer‐scale integration is the extension of the system‐on‐chip approach to ultralarge systems. A comprehensive review of this transition from the standpoint of packaging, thermal management, and system integration is presented in this article. The benefits and challenges of wafer‐scale integration are discussed. Silicon interconnect fabric, a promising platform for high‐performance heterogeneous wafer‐scale integration, is introduced.
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