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We report on the development of a large-area few-layer graphene (FLG)—based transparent conductive electrode as a current spreading layer for GaN-based ultraviolet (UV) light-emitting diodes (LEDs). Large-area FLG was deposited on Cu using the chemical vapor deposition (CVD) method and subsequently transferred to the surface of the UV LED. UV light at a peak of 372 nm was emitted through the FLG-based transparent conductive electrode. The current spreading effects of FLG were clearly evident in both the optical images of electroluminescence (EL) and current-voltage (I-V) characteristics. Degradation of the FLG-based transparent conductive electrode could be induced by high power operation. Our results indicate that a large-area FLG-based electrode on GaN offers excellent current spreading and ultra-violet transparency properties when compared to the standard optoelectronic indium tin oxide (ITO) contact layer.

Atomically thin 2D materials span the common components of electronic circuits as metals, semiconductors, and insulators, and can manifest correlated phases such as superconductivity, charge density waves, and magnetism. An ongoing challenge in the field is to incorporate these 2D materials into multilayer heterostructures with robust electrical contacts while preventing disorder and degradation. In particular, preserving and studying air-sensitive 2D materials has presented a significant challenge since they readily oxidize under atmospheric conditions. We report a new technique for contacting 2D materials, in which metal via contacts are integrated into flakes of insulating hexagonal boron nitride, and then placed onto the desired conducting 2D layer, avoiding direct lithographic patterning onto the 2D conductor. The metal contacts are planar with the bottom surface of the boron nitride and form robust contacts to multiple 2D materials. These structures protect air-sensitive 2D materials for months with no degradation in performance. This via contact technique will provide the capability to produce "atomic printed circuit boards" that can form the basis of more complex multilayer heterostructures.

Crystalline two-dimensional (2D) superconductors (SCs) with low carrier density are an exciting new class of materials in which electrostatic gating can tune superconductivity, electronic interactions play a prominent role, and electrical transport properties may directly reflect the topology of the Fermi surface. Here, we report the dramatic enhancement of superconductivity with decreasing thickness in semimetallic T d-MoTe2, with critical temperature (T c) increasing up to 7.6 K for monolayers, a 60-fold increase with respect to the bulk T c. We show that monolayers possess a similar electronic structure and density of states (DOS) as the bulk, implying that electronic interactions play a strong role in the enhanced superconductivity. Reflecting the low carrier density, the critical temperature, magnetic field, and current density are all tunable by an applied gate voltage. The response to high in-plane magnetic fields is distinct from that of other 2D SCs and reflects the canted spin texture of the electron pockets.

Indium selenide (InSe) and gallium selenide (GaSe), members of the III−VI chalcogenide family, are emerging two-dimensional (2D) semiconductors with appealing electronic properties. However, their devices are still lagging behind because of their sensitivity to air and device fabrication processes which induce structural damage and hamper their intrinsic properties. Thus, in order to obtain high-performance and stable devices, effective passivation of these air-sensitive materials is strongly required. Here, we demonstrate a hexagonal boron nitride (hBN)-based encapsulation technique, where 2D layers of InSe and GaSe are covered entirely between two layers of hBN. To fabricate devices out of fully encapsulated 2D layers, we employ the lithography-free via-contacting scheme. We find that hBN acts as an excellent encapsulant and a near-ideal substrate for InSe and GaSe by passivating them from the environment and isolating them from the charge disorder at the SiO 2 surface. As a result, the encapsulated InSe devices are of high quality and ambient-stable for a long time and show an improved two-terminal mobility of 30−120 cm 2 V −1 s −1 as compared to mere ∼1 cm 2 V −1 s −1 for unencapsulated devices. On employing this technique to GaSe, we obtain a strong and reproducible photoresponse. In contrast to previous studies, where either good performance or long-term stability was achieved, we demonstrate a combination of both in our devices. This work thus provides a systematic study of fully encapsulated devices based on InSe and GaSe, which has not been reported until now. We believe that this technique can open ways for fundamental studies as well as toward the integration of these materials in technological applications.

β-Ga(2)O(3) films grown on Al(2)O(3) by a metalorganic chemical vapor deposition technique were used to fabricate a solar-blind photodetector with a planar photoconductor structure. The crystal structure and quality of the β-Ga(2)O(3) films were analyzed using X-ray diffraction and micro-Raman spectroscopy. Si ions were introduced into the β-Ga(2)O(3) thin films by ion implantation method and activated by an annealing process to form an Ohmic contact between the Ti/Au electrode and the β-Ga(2)O(3) film. The electrical conductivity of the β-Ga(2)O(3) films was greatly improved by the implantation and subsequent activation of the Si ions. The photoresponse properties of the photodetectors were investigated by analyzing the current-voltage characteristics and the time-dependent photoresponse curves. The fabricated solar-blind photodetectors exhibited photoresponse to 254 nm wavelength, and blindness to 365 nm light, with a high spectral selectivity.

We report the chemical etching characteristics of Ga-face and N-face GaN using phosphoric acid (H 3 PO 4 ) or potassium hydroxide (KOH) solutions. Hexagonal pyramids, which consisted of the {10-1-1} planes, were present on the N-face after KOH (2M, 100 • C) etching. By contrast, using the H 3 PO 4 (85 wt.%, 100 • C) solutions, the nitrogen surface of GaN showed dodecagonal pyramids. Dodecagonal and hexagonal pyramids repeatedly appear on the etched surface when using the H 3 PO 4 or KOH solutions, respectively. A low concentration of H 3 PO 4 (H 3 PO 4 : deionized water = 1:32, 1:64) produced a roughened surface with coexistence of dodecagonal and hexagonal pyramids. The photoluminescence (PL) intensity of the etched surfaces significantly increased due to multiple scattering events compared to the non-etched surface. Thus, the etching techniques developed in this study were shown to improve the light extraction efficiency of light emitting diodes (LEDs), avoiding the damage to the GaN typically created by plasma etching methods.

A 2 in. active‐matrix light‐emitting diode (AMLED) display by integration of the micro‐LED onto the oxide thin‐film transistor (TFT) backplane using flip chip bonding is reported. A blue‐emitting micro‐LED (µ‐LED) with a size of 90 × 50 µm2 is fabricated on the GaN epi grown on a sapphire substrate. The amorphous indium‐gallium‐zinc‐oxide (a‐IGZO) TFT on glass exhibiting the mobility of 18.4 cm2 V−1 s−1, turn‐on voltage (V ON) of 0.2 V, and subthreshold swing 0.25 V dec−1, is used for LED backplane. A two TFT and one capacitance pixel structure is utilized for driving 128 × 384 AMLED with 120 Hz frame rate. The laser lift‐off process with flip‐chip bond allows the transfer of the µ‐LED chips with 49 152 pixels onto the TFT backplane, demonstrating a 2 in. AMLED display with a good gray scale image. The current efficiency of µ‐LED is found to be 12.9 Cd A−1 at the luminance of 630 Cd m−2. Therefore, a‐IGZO TFT backplane can be used for µ‐LED displays.