Grain boundaries in graphene are formed by the joining of islands during the initial growth stage, and these boundaries govern transport properties and related device performance. Although information on the atomic rearrangement at graphene grain boundaries can be obtained using transmission electron microscopy and scanning tunnelling microscopy, large-scale information regarding the distribution of graphene grain boundaries is not easily accessible. Here we use optical microscopy to observe the grain boundaries of large-area graphene (grown on copper foil) directly, without transfer of the graphene. This imaging technique was realized by selectively oxidizing the underlying copper foil through graphene grain boundaries functionalized with O and OH radicals generated by ultraviolet irradiation under moisture-rich ambient conditions: selective diffusion of oxygen radicals through OH-functionalized defect sites was demonstrated by density functional calculations. The sheet resistance of large-area graphene decreased as the graphene grain sizes increased, but no strong correlation with the grain size of the copper was revealed, in contrast to a previous report. Furthermore, the influence of graphene grain boundaries on crack propagation (initialized by bending) and termination was clearly visualized using our technique. Our approach can be used as a simple protocol for evaluating the grain boundaries of other two-dimensional layered structures, such as boron nitride and exfoliated clays.

In spite of recent successful demonstrations of flexible and transparent graphene heaters, the underlying heat‐transfer mechanism is not understood due to the complexity of the heating system. Here, graphene/glass defoggers are fabricated and the dynamic response of the temperature as a function of input electrical power is measured. The graphene/glass defoggers reveal shorter response times than Cr/glass defoggers. Furthermore, the saturated temperature of the graphene/glass defoggers is higher than for Cr/glass defoggers at a given input electrical power. The observed dynamic response to temperature is well‐fitted to the power‐balance model. The response time of graphene/glass defogger is shorter by 44% than that of the Cr/glass defogger. The convective heat‐transfer coefficient of graphene is 12.4 × 10−4 W cm−2 °C−1, similar to that of glass (11.1 × 10−4 W cm−2 °C−1) but smaller than that of chromium (17.1 × 10−4 W cm−2 °C−1). The graphene‐based system reveals the lowest convective heat‐transfer coefficient due to its ideal flat surface compared to its counterparts of carbon nanotubes (CNTs) and reduced graphene oxide (RGO)‐based systems.

The doping/dedoping mechanism of carbon nanotubes (CNTs) with AuCl(3) has been investigated with regard to the roles of cations and anions. Contrary to the general belief that CNTs are p-doped through the reduction of cationic Au(3+) to Au(0), we observed that chlorine anions play a more important role than Au cations in doping. To estimate the effects of Cl and Au on CNTs, the CNT film was dedoped as a function of the annealing temperature (100-700 °C) under an Ar ambient and was confirmed by the sheet resistance change and the presence of a G-band in the Raman spectra. The X-ray photoelectron spectroscopy (XPS) analysis revealed that the doping level of the CNT film was strongly related to the amount of adsorbed chlorine atoms. Annealing at temperatures up to 200 °C did not change the amount of adsorbed Cl atoms on the CNTs, and the CNT film was stable under ambient conditions. Alternatively, Cl atoms started to dissociate from CNTs at 300 °C, and the stability of the film was degraded. Furthermore, the change in the amount of Cl atoms in CNTs was inversely proportional to the change in the sheet resistance. Our observations of the Cl adsorption, either directly or mediated by an Au precursor on the CNT surface, are congruent with the previous theoretical prediction.

Use of random network carbon nanotube (CNT) transistors and their applications to complementary logic gates have been limited by several factors such as control of CNT density, existence of metallic CNTs producing a poor yield of devices, absence of stable n-dopant and control of precise position of the dopant, and absence of a scalable and cost-effective fabrication process. Here, we report a scalable and cost-effective fabrication of complementary logic gates by precisely positioning an air-stable n-type dopant, viologen, by inkjet printing on a separated semiconducting CNTs network. The obtained CNT transistors showed a high yield of nearly 100% with an on/off ratio of greater than 10(3) in an optimized channel length (∼9 μm). The n-doped semiconducting carbon nanotube transistors showed a nearly symmetric behavior in the on/off current and threshold voltage with p-type transistors. CMOS inverter, NAND, and NOR logic gates were integrated on a HfO2/Si substrate using the n/p transistor arrays. The gain of inverter is extraordinarily high, which is around 45, and NAND and NOR logic gates revealed excellent output on and off voltages. These series of whole processes were conducted under ambient conditions, which can be used for large-area and flexible thin film technology.

We propose bis(trifluoromethanesulfonyl)imide [(CF(3)SO(2))(2)N](-) (TFSI) as a transparent strong electron-withdrawing p-type dopant in carbon nanotubes (CNTs). The conventional p-dopant, AuCl(3), has several drawbacks, such as hygroscopic effect, formation of Au clusters, decrease in transmittance, and high cost in spite of the significant increase in conductivity. TFSI is converted from bis(trifluoromethanesulfonyl)amine (TFSA) by accepting electrons from CNTs, subsequently losing a proton as a characteristic of a Brønsted acid, and has an inductive effect from atoms with high electronegativity, such as halogen, oxygen, and nitrogen. TFSI produced a similar improvement in conductivity to AuCl(3), while maintaining high thermal stability, and no appreciable change in transmittance with no cluster formation. The effectiveness of TFSI was compared with that of other derivatives.