The strengthening effects of the Cu-80 wt.% W (CuW80) alloy and the copper parts in Cu-80wt.% W /Cu (CuW80/Cu) solid contact alloy, which was sintered and infiltrated prepared by powder metallurgy, were investigated. The effects of different compressive deformation on microstructure and properties of the CuW80 were studied. Furthermore, the influences of HextrusionH on copper parts, the carrier material of the solid contact alloy CuW80/Cu were also investigated. The results show that the tungsten and copper phases are closely bonded by physical bond in the form of pseudo-alloy and the copper phase is homogeneously dispersed within the tungsten framework. The hardness of the CuW80 increases with increasing compressive deformation. Especially, the hardness of the copper parts in CuW80/Cu increases remarkably after extrusion and the maximum value can reach 200%. The hardness increases from the inner to the surface and is proportional to the distance departing from the interface of the CuW80 and Cu. TEM observation shows that the dislocation tangles exist, even inside the dislocation cell, in copper grains after extrusion.
Three-dimensional finite element simulation (3D FES) and experiments were carried out for analyzing the deformation behavior, homogeneity, microstructure and properties of 5052 Al alloy during groove pressing (GP) with two different processing conditions, that is, constrained groove pressing (CGP) and unconstrained groove pressing (UGP). The simulation results show that the values of the equivalent strain and its distribution depend strongly on the constrained conditions. Especially, the equivalent strain and its distribution are inhomogeneous along X direction, with lower strain regions located at both ends and larger strain regions with periodic variation located at intermediate section. CGP results in a higher accumulative rate of equivalent strain than that of UGP. The average strain is equal to the theoretical strain for CGP, but it is much lower than its theoretical strain for UGP. The experimental results show that grain sizes of 5052 Al alloy can be refined significantly by CGP or UGP, while CGP has a higher rate of grain refinement and finer grains than that of UGP. And the results of microhardness confirmed the prediction of 3D FES.
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