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Direct manufacturing of customized end-use electronic products is becoming an emerging trend of additive manufacturing (AM). This highly demands the evolution of the conventional AM processes from simply building single-material parts to simultaneously delivering complex structures and end-use functionalities. In this work, we propose a novel hybrid additive manufacturing solution that combines stereolithography (SLA) three-dimensional (3D) printing and laser-activated electroless plating for the manufacture of 3D fully functional electronic products. With our newly developed functional SLA resin that can be 3D printed, laser-activated, and thereafter selectively metalized, high-resolution circuitry can be free-formly patterned on 3D structures. In virtue of high-performance electrical materials, this technology is capable of creating not only 3D direct-current (DC) electronics but also 3D high-frequency devices like microwave/millimeter-wave antennas, which cannot be fabricated via traditional printed circuit board (PCB) technology and not even by most AM processes. This study represents a significant advance in additive manufacturing technologies, and more importantly offers a unique opportunity for the mass customization of fully functional 3D electronic products, which shows great potentials in consumer electronics, communication engineering, and automobile and aerospace industries.

A series of tricyclic, conformationally constrained Smac mimetics have been designed, synthesized and evaluated. The most potent compound 6 (WS-5) binds to XIAP, cIAP-1 and cIAP-2 with Ki values of 18, 1.1 and 4.2 nM, respectively. Compound 6 antagonizes XIAP in a functional assay and induces cIAP-1 degradation. Compound 6 inhibits cell growth with an IC50 value of 68 nM in the MDA-MB-231 cancer cell line and effectively induces cancer cells to undergo apoptosis.

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