Etching characteristics in three different modes employing an M = 0 helicon plasma were compared. It was concluded that high selectivity could not be realized in the high source power operation mode in principle. The comparison between the time-modulated discharge mode and the low source power operation mode in the continuous discharge revealed that almost identical etching characteristics could be obtained if, and only if, the imposed source power in the continuous discharge was equal to the net source power in the time-modulated discharge. It was also confirmed that the degree of dissociation of process gases could be controlled by adjusting the source power in a continuous discharge by an M = 0 helicon plasma.
When applying high-density plasma to SiO2 etching, the ability to control the degree of dissociation is critical. In this study, two methods for controlling the degree of dissociation were evaluated using M=0 helicon wave plasma. One method was time-modulated discharge and the other adjusting the source power in the conventional continuous discharge. It was concluded that almost identical etching characteristics could be obtained, at least in M=0 helicon wave plasma, if and only if the applied source power in the continuous discharge was equal to the net source power in the time-modulated discharge. The probe measurement revealed that the electron temperature did not change with increasing source power; however, the emission spectroscopic study indicated that the high-energy tail of the electron-energy distribution function grew with increasing source power. This is considered to be the cause of the high degree of dissociation.
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