Abstract. This article reports on the investigation of technological features magnetron sputtering for deposition anti-reflection layers in low-emission (low-e) coatings. The threelayer TiO 2 -Cu-TiO 2 films were deposited by dual and planar magnetron sputtering systems (MS) on glass substrate. Studies of the current-voltage characteristics (CVC) and the hysteresis effect show that deposition of anti-reflection layers is possible in the transition mode with higher rates. For planar magnetron, the stability of electrical discharge parameters is achieved at 60 % O 2 content in mixture. The calculations optical band gap E g show that anti-reflective films have a rutile or anatase phases that depending on the content O 2 in gas mixture. The optimum deposition conditions of TiO 2 films were determined for all modifications of magnetrons. Anti-reflective layers, which are deposited by balanced dual MS, improve the transparency of low-e coatings (integral T VIS increase in 15%).
IntroductionAt present, low-e coatings are widely used to reduce heat loss in residential buildings [1]. The simplest structure of such multilayer film composition is dielectric-metal-dielectric having the following properties: a high transmittance T VIS in the visible region (approximately 0.8), and high reflection R IR in the infrared range (0.85-0.9) [2]. The main functional layer is a semi-transparent metal (Cu, Ag). The translucence of low-e coating is achieved by deposition anti-reflection layers. Predominantly, such films are oxides metals (TiO 2 , SnO 2 , ZnO).The main problem of heat-reflective coating is in the deposition of high-quality anti-reflective layers on account of variability of process parameters in the reactive process. Magnetron sputtering, preferably used for deposition optical coatings, is associated with the following disadvantages: no stability of electrical discharge parameters, poisoning target, electric breakdowns on target [3]. Therefore, the main purposes of this study are to determine the technological features of the magnetron in case of reactive process and investigate the effect of plasma source to the properties of the low-e films. In this work, we used Cu as a model metal material, anti-reflective layer -TiO 2 .
Bioresorbable scaffolds from poly(lactide-co-glycolide) (PLGA) were formed by electrospinning. Then, plasma modification of PLGA scaffolds was carried out by magnetron co-sputtering of copper and titanium targets in Ar. The surface morphology, elemental composition and mechanical properties of the obtained samples were investigated. The modes of plasma modification were selected that could preserve the macrostructure, morphology and mechanical properties of PLGA scaffolds.
The article reports on the aspects of reactive deposition ultra-thin TiOx films (50 nm) by means of dual magnetron system with mirror and closed magnetic field (B field) configurations. The hysteresis effect of electrical discharge characteristics and oxygen partial pressure P(O2) are presented. The dual magnetron with closed B field configuration has less hysteresis peculiarities and transits back to metallic deposition mode at higher O2 flow rate (Q). The deposition rates don’t depend on B field configuration and correlate with changing of P(O2) and discharge voltage. The refractive spectra and energy of band gap, which are measured by UV-visible spectrophotometry and ellipsometry (λ=632.8 nm) methods, have strong dependence on Q(O2).
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