Electro-optic (EO) modulators with a high modulation bandwidth are indispensable parts of an optical interconnect system. A key requirement for an energy-efficient EO modulator is the low drive voltage, which can be provided using a standard complementary metal oxide semiconductor circuity without an amplifying driver. Thin-film lithium niobate has emerged as a new promising platform, and shown its capable of achieving driverless and high-speed EO modulators. In this paper, we report a compact high-performance modulator based on the thin-film lithium niobate platform on a silicon substrate. The periodic capacitively loaded travelling-wave electrode is employed to achieve a large modulation bandwidth and a low drive voltage, which can support a driverless single-lane 100Gbaud operation. The folded modulation section design also helps to reduce the device length by almost two thirds. The fabricated device represents a large EO bandwidth of 45GHz with a half-wave voltage of 0.7V. The driverless transmission of a 100Gbaud 4-level pulse amplitude modulation signal is demonstrated with a power consumption of 4.49fj/bit and a bit-error rate below the KP4 forward-error correction threshold of 2.4×10−4.
Silicon nitride (SiN) emerges as an important platform for ultralow loss photonic integrations with complementary metal‐oxide‐semiconductor compatibility. However, active devices, such as modulators, are difficult to realize on pure SiN due to the lack of any electro‐optic (EO) properties of the material. Here, an SiN and lithium niobate (LN) heterogenous integration platform supporting high‐performance EO modulators on SiN waveguide circuits is introduced. An efficient evanescent coupling structure is realized for low‐loss light transitions between the SiN waveguide and the LN ridge waveguide with a measured mode transition loss of only 0.4 dB. Based on this heterogeneous platform, an EO Mach–Zender interference modulator on SiN is built with unprecedented loss, efficiency, and bandwidth performances. A half‐wave voltage of 4.3 V with a modulation bandwidth of 37 GHz and an overall insertion loss of 1 dB is measured for a 7‐mm long device. Data transmission up to 128 Gb s−1 with a bit‐error‐rate of <2.4 × 10‐4 is also demonstrated.
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