AlGaN and GaN sidewalls
were turned into Al
x
Ga
2–
x
O
3
and Ga
2
O
3
, respectively,
by thermal oxidation to improve
the optoelectrical characteristics of deep ultraviolet (DUV) light-emitting
diodes (LEDs). The thermally oxidized Ga
2
O
3
is
a single crystal with nanosized voids homogenously distributed inside
the layer. Two oxidized Al
x
Ga
2–
x
O
3
layers were observed on the sidewall
of the AlGaN layer in transmission electron microscopy images. The
first oxidized Al
x
Ga
2–
x
O
3
layer is a single crystal, while the
second oxidized Al
x
Ga
2–x
O
3
layer is a single crystal with numerous nanosized voids
inside. The composition of Al in the first oxidized Al
x
Ga
2–
x
O
3
layer is higher than that in the second one. The thermal oxidation
at high temperature degrades the quality of the p-GaN layer and increases
the forward voltage from 8.18 to 11.36 V. The thermally oxidized Al
x
Ga
2–
x
O
3
sidewall greatly enhances the light extraction efficiency
of the lateral light of the DUV LEDs by combined mechanisms of holey
structure, graded refractive index, high transparency, and tensile
stress. Consequently, the light output power of the DUV LEDs increases
from 0.69 to 0.88 mW by introducing a 420 nm thick Al
x
Ga
2–
x
O
3
sidewall oxidized at 900 °C, in which the enhancement of light
output power can reach 27.5%.