By incorporating magnetic particles into elevated temperature-curing adhesives, or hot-meltable thermoplastics, induction fields can be used to heat bondlines and join composite adherends. In this article we investigate the fundamental heating behaviors of such magnetic particles in order to aid in the design and selection of improved magnetic materials. Magnetic inductive heating tests were performed on two types of magnetic materials: Co2Ba2Fe12O22 semihard ferrites and NiFe2O4 soft ferrites. The Curie temperatures of these ferrites were also varied through Zn substitution. All of the samples clearly demonstrated Curie temperature-controlled final heating behavior. The magnitude of heat generation has been related to dc magnetic hysteresis measurements, with reasonable agreement. Deviations are theorized to be due to domain wall resonance effects.
Hiperco® 50 alloy heat treated between 450 and 650 °C exhibits superior mechanical properties. We report the measurements of the ac core loss at various frequencies up to 4500 Hz of the Hiperco® 50 alloy samples annealed at 450 and 650 °C. The 650 °C annealed specimens have lower ac core loss than that of the 450 °C annealed ones. The total core loss, consisting of contributions from hysteresis core loss and eddy-current core loss, depends on frequency f as af+bf2. The eddy-current loss of a single laminate is minor compared to the hysteresis loss.
scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.
hi@scite.ai
10624 S. Eastern Ave., Ste. A-614
Henderson, NV 89052, USA
Copyright © 2024 scite LLC. All rights reserved.
Made with 💙 for researchers
Part of the Research Solutions Family.