A liquid lens based on the electrowetting phenomenon was designed to be cylindrical to minimize dead area. The lens was fabricated with microelectromechanical-system (MEMS) technology using silicon thin film and wafer bonding processes. A multiple dielectric layer comprising Teflon, silicon nitride, and thermal oxide was formed on the cylinder wall. With a change of 11 V rms in the applied bias, the lens module, including the fabricated liquid lens, showed a focal length change of approximately 166 mm. A capsule endoscope was assembled, including the lens module, and was successfully used to take images of a pig colon at various focal lengths.
A silicon-to-silicon anodic bonding process using a glass layer deposited by electron beam evaporation will be described. Wafers are bonded at a temperature as low as 135 °C with an applied voltage as small as 35 Vdc, enabling this technique to be applied to vacuum packaging of microelectronic devices. Experimental results reveal that an evaporated glass layer of more than 1 μm thick is suitable for anodic bonding. Finally, the role of sodium ions in anodic bonding was also studied by investigating the theoretical bonding mechanism and examining the results of secondary ion mass spectroscopy analysis.
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