The growth morphology of epitaxial 3C-SiC crystals grown on hexagonal pillars deeply etched into Si (111) substrates is presented. Different growth velocities of side facets let the top crystal facet evolve from hexagonal towards triangular shape during growth. The lateral size and separation between Si pillars determine the onset of fusion between neighboring crystals during growth at a height tailoring of which is crucial to reduce the stacking fault (SF) density of the coalesced surface. Intermediate partial fusion of neighboring crystals is shown as well as a surface of fully coalesced crystals.
10 kV, 2 A SiC p-i-n diodes have been designed and fabricated. The devices feature excellent stability of forward characteristics and robust junction termination with avalanche capability of 1 J. The fabricated diodes have been electrically evaluated with respect to dynamic ON-state voltage, reverse recovery behavior, bipolar stability, and avalanche capability. More than 60% reduction of losses has been demonstrated using newly developed 10-kV p-i-n diodes in a multikilowatt high voltage, high-frequency dc/dc soft-switching converter.
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