Thick organic bulk heterojunction photodiodes with low dark current <1nA∕cm2 and efficient charge collection are reported. An electric field >1V∕μm is sufficient to achieve >75% charge collection in films of poly[2-methoxy-5-(2-ethylhexyloxy)-1,4-phenylene-vinylene] and [6,6]-phenyl-C61-butyric acid methyl ester blends up to 4μm thick, and the rate of photocurrent decay is reduced at saturation fields. The integration of a 4μm thick sensor layer onto a flexible amorphous silicon thin-film transistor backplane gave an image sensor array with 35% external quantum efficiency and noise equivalent power of 30pW∕cm2 at reverse bias voltage of −4V.
Indium–gallium nitride (InGaN) multiple-quantum-well (MQW) light-emitting diode (LED) membranes, prefabricated on sapphire growth substrates, were created using pulsed-excimer laser processing. The thin-film InGaN MQW LED structures, grown on sapphire substrates, were first bonded onto a Si support substrate with an ethyl cyanoacrylate-based adhesive. A single 600 mJ/cm2, 38 ns KrF (248 nm) excimer laser pulse was directed through the transparent sapphire, followed by a low-temperature heat treatment to remove the substrate. Free-standing InGaN LED membranes were then fabricated by immersing the InGaN LED/adhesive/Si structure in acetone to release the device from the supporting Si substrate. The current–voltage characteristics and room-temperature emission spectrum of the LEDs before and after laser lift-off were unchanged.
Thin-film transistor (TFT) backplanes fabricated by using jet printing as the only patterning method are reported. Additive and subtractive printing processes are combined to make 128×128 pixel active matrix arrays with 340μm pixel size. The semiconductor used, a regioregular polythiophene, poly[5,5′-bis(3-dodecyl-2-thienyl)-2,2′-bithiophene]; (PQT-12) is deposited by inkjet printing and exhibits average TFT mobility of 0.06cm2∕Vs, on/off ratios of 106, and minimal bias stress. The printed TFTs have high yield with a narrow performance distribution. The pixel design benefits from the registration accuracy of jet printing and it is shown that the electrical performance is suitable for addressing capacitive media displays.
Gallium nitride thin films grown on sapphire substrates were successfully separated and transferred onto Si substrates using single 38 ns KrF excimer laser pulses directed through the transparent substrate at fluences in the range of 400–600 mJ/cm2. The absorption of the 248 nm radiation by the GaN at the interface induces rapid thermal decomposition of the interfacial layer, yielding metallic Ga and N2 gas. The substrate is easily removed by heating above the Ga melting point of 30 °C. Scanning electron microscopy and x-ray diffraction of the GaN films before and after lift-off demonstrate that the structural quality of the GaN films is not altered by the separation and transfer process.
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