No abstract

Amine-functionalized graphene oxide nanosheets were prepared by linear poly(oxyalkylene)amines with two different molecular weights, 400 and 2000 (D400 and D2000), attached onto the surface of graphene oxides.

Presented is a novel process of benzo-cyclo-butene (BCB) bonding for a wafer level package with 'stamp' printing, in which the BCB structure is transferred and patterned by pressing the cap wafer towards another wafer with a liquid BCB layer. Compared with the conventional BCB bonding process, this new method not only avoids the residual polymer inside the cavity to extend the application of BCB bonding in the complex three-dimensional structures but also raises the bonding strength because of the non-treatment before bonding. The key process parameters, such as the auxiliary wafer material, pre-curing time and bonding pressure were optimised after a series of contrast experiments. The bonding quality was evaluated qualitatively by manual separation and quantitatively by a tensile bonding test. This new method has a minimum bonding strength of 5.9 MPa, which is more than ten times the conventional one. Besides, the bonding yield reaches 80% in five groups of 4-inch wafers. Finally, this process was successfully utilised in an acceleration microswitch.

In this paper, a convenient wafer level bonding based on un-patterned BCB to achieve all-silicon structures was presented. This method is easy to operate, and can be applied in the multi-wafer bonding. After the BCB was spin-coated on the substrate wafer and soft-baked, no process had been carried out on it. Both the time node of pressure applied to the bonding and the BCB soft-bake process had been explored before bonding two wafers. After bonding, the obtained results indicated that the BCB transverse deformation of this BCB bonding was less than 36μm at the optimal soft-bake temperature of 170 with the soft-bake time of 40min. Also, the bonding strength of the BCB bonding was tested by DAGE 4000, and the results were 15~17MPa, which is suitable for the needs of the wafer level bonding.

The work is aimed to investigate the suitability of poly (γ-glutamic acid) (γ-PGA) for the hydrophilic finishing of polyester fiber. γ-PGA hydrogel was successfully synthesized by a simple mixture process in the aqueous solution. A novel hydrophilic finishing agent was prepared by γ-PGA hydrogel. The rheology behavior study indicated that γ-PGA solution and hydrophilic finishing agent performed pseudoplastic fluid and approximately Newtonian behavior, respectively. The particle diameter determined that particles in hydrophilic finishing agent reached micro-nanograde. Furthermore, polyester fiber was treated with γ-PGA solution and hydrophilic finishing agent. Moisture regain was evaluated as a key performance, results shown the hydrophilicity of polyester fiber was greatly enhanced by γ-PGA finishing.