This study explores how surface morphology affects the dynamics of contact line depinning of an evaporating sessile droplet on micropillared superhydrophobic surfaces. The result shows that neither a liquid-solid contact area nor an apparent contact line is a critical physical parameter to determine the depinning force. The configuration of a contact line on a superhydrophobic surface is multimodal, composed of both two phases (liquid and air) and three phases (liquid, solid, and air). The multimodal state is dynamically altered when a droplet recedes. The maximal three-phase contact line attainable along the actual droplet boundary is found to be a direct and linear parameter that decides the depinning force on the superhydrophobic surface.
Evaporation modes and kinetics of sessile droplets of water on micropillared superhydrophobic surfaces are experimentally investigated. The results show that a constant contact radius (CCR) mode and a constant contact angle (CCA) mode are two dominating evaporation modes during droplet evaporation on the superhydrophobic surfaces. With the decrease in the solid fraction of the superhydrophobic surfaces, the duration of a CCR mode is reduced and that of a CCA mode is increased. Compared to Rowan's kinetic model, which is based on the vapor diffusion across the droplet boundary, the change in a contact angle in a CCR (pinned) mode shows a remarkable deviation, decreasing at a slower rate on the superhydrophobic surfaces with less-solid fractions. In a CCA (receding) mode, the change in a contact radius agrees well with the theoretical expectation, and the receding speed is slower on the superhydrophobic surfaces with lower solid fractions. The discrepancy between experimental results and Rowan's model is attributed to the initial large contact angle of a droplet on superhydrophobic surfaces. The droplet geometry with a large contact angle results in a narrow wedge region of air along the contact boundary, where the liquid-vapor diffusion is significantly restricted. Such an effect becomes minor as the evaporation proceeds with the decrease in a contact angle. In both the CCR and CCA modes, the evaporative mass transfer shows the linear relationship between mass(2/3) and evaporation time. However, the evaporation rate is slower on the superhydrophobic surfaces, which is more significant on the surfaces with lower solid fractions. As a result, the superhydrophobic surfaces slow down the drying process of a sessile droplet on them.
A new method is reported for preparing carbon nanotube (CNT) films. This method involves the continuous production of a hollow cylindrical CNT assembly and its condensation on a winding drum. The alignment and densification of CNTs in the film are improved by controlling the winding rate and imposition of mechanical rolling, respectively. The prepared film has a strength of 9.6 GPa, which is well above those for all other man-made films and fibers.
Highly ordered ultra-long oxide nanotubes are fabricated by a simple two-step strategy involving the growth of copper nanowires on nanopatterned template substrates by magnetron sputtering, followed by thermal annealing in air. The formation of such tubular nanostructures is explained according to the nanoscale Kirkendall effect. The concept of this new fabrication route is also extendable to create periodic zero-dimensional hollow nanostructures.
a b s t r a c tAdhesive bonding structures are widely used in a variety of engineering fields. Their overall strength is dependent on the cohesive properties involving local interface fracture. In the present research, the influence of the adhesive thickness on the cohesive properties and the overall strength of metallic adhesive bonding structures are investigated, with the cohesive zone model employed to equivalently simulate the adhesive layers with various thicknesses. A theoretical approach has been developed to determine the cohesive parameters for the present model when the adhesive thickness is varied. And then some numerical examples are given to explore the adhesive thickness-dependence overall strength of the adhesive joints, followed by some comparisons with the existing experimental results. Furthermore, the variations of both the cohesive parameters and the overall strength with the various thicknesses are influenced by some intrinsic characteristics of adhesives, which are investigated finally. The results show that both the cohesive parameters and the overall strength of metallic adhesive bonding structures are much dependent on the adhesive thickness, and the variations of overall strength resulting from the various thicknesses have discrepancy due to the toughness and strain hardening capacity of adhesives.Crown
Using the vertical standing wave phenomena commonly regarded as a deterrent in holographic lithography, multifaceted three‐dimensional (3D) nanostructures are fabricated on polymeric photoresist materials using a simple two‐beam interferometer. Large‐area 3D nanostructures with high aspect ratios (greater than 10) are readily produced using this methodology, including grating, pillar and pore patterns. Furthermore, manipulation of the lithography process conditions results in unique sidewall profiles of the nanostructures. Such 3D holographic control even produces highly porous polymer membranes composed of 3D interconnected pore networks, which resembles the 3D photonic crystal compound nanostructures that were previously attainable only with limited pattern coverage area using complex multibeam holographic lithography processes. Such well‐tailored high‐aspect‐ratio 3D nanostructures with large pattern coverage area further enable the fabrication of novel nanostructures for functionalized materials via various additive and subtractive pattern transfer techniques such as etching, deposition, and molding. In particular, direct molding followed by thermal decomposition process leads to the synthesis of hierarchical titanium oxide nanostructures of tunable 3D geometry, which would be of great significance in applications of photonic crystals, photovoltaic solar cells, and photocatalyst in water decontamination.
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