In this work, a flash-light sintering process for Cu nanoinks was studied. In order to precisely monitor the milliseconds flash-light sintering process, a real-time Wheatstone bridge electrical circuit and a high-rate data acquisition system were used. The effects of several flash-light irradiation conditions (irradiation energy, pulse number, on-time, and off-time) and the effects of the amount of poly(N-vinylpyrrolidone) in the Cu nanoink on the flash-light sintering process were investigated. The microstructures of the sintered Cu films were analyzed by scanning electron microscopy. To investigate the oxidation or reduction of the oxide-covered copper nanoparticles, a crystal phase analysis using x-ray diffraction was performed. In addition, the sheet resistance of Cu film was measured using a four-point probe method. From this study, it was found that the flash-light sintered Cu nanoink films have a conductivity of 72 Ωm/sq without any damage to the polyimide substrate. Similar nanoinks are expected to be widely used in printed and flexible electronics products in the near future.

No abstract

In this work, a flash light sintering process using silver nano-inks is investigated. A silver nano-ink pattern was printed on a flexible PET (polyethylene terephthalate) substrate using a gravure-offset printing system. The printed silver nano-ink was sintered at room temperature and under ambient conditions using a flash of light from a xenon lamp using an in-house flash light sintering system. In order to monitor the light sintering process, a Wheatstone bridge electrical circuit was devised and changes in the voltage difference of the silver nano-ink were recorded during the sintering process using an oscilloscope. The sheet resistance changes during the sintering process were monitored using the in situ monitoring system devised, under various light conditions (e.g. light energy, on-time and off-time duration, and pulse numbers). The microstructure of the sintered silver film and the interface between the silver film and the PET substrate were observed using a scanning electron microscope, a focused ion beam and an optical microscope. The electrical sheet resistances of the sintered silver films were measured using a four-point probe method. Using the in situ monitoring system devised, the flash light sintering mechanism was studied for each type of light pulse (e.g. evaporation of organic binder followed by the forming of a neck-like junction and its growth, etc).The optimal flash light sintering condition is suggested on the basis of the in situ monitoring results. The optimized flash light sintering process produces a silver film with a lower sheet resistance (0.95 Ω/sq) compared with that of the thermally sintered silver film (2.03 Ω/sq) without damaging the PET substrate or allowing interfacial delamination between the silver film and the PET substrate.

A schematic representation of the white flash light welding process of a percolated Cu NW network electrode.

In this work, an intensive plasmonic flash light sintering technique was developed by using a band-pass light filter matching the plasmonic wavelength of the copper nanoparticles. The sintering characteristics, such as resistivity and microstructure, of the copper nanoink films were studied as a function of the range of the wavelength employed in the flash white light sintering. The flash white light irradiation conditions (e.g., wavelength range, irradiation energy, pulse number, on-time, and off-time) were optimized to obtain a high conductivity of the copper nanoink films without causing damage to the polyimide substrate. The wavelength range corresponding to the plasmonic wavelength of the copper nanoparticles could efficiently sinter the copper nanoink and enhance its conductivity. Ultimately, the sintered copper nanoink films under optimal light sintering conditions showed the lowest resistivity (6.97 μΩ·cm), which was only 4.1 times higher than that of bulk copper films (1.68 μΩ·cm).